Exhibited at SEMICON TAIWAN 2019

We exhibited at SEMICON TAIWAN, which we participated in last year, again this year. In the era of IoT, we exhibited the latest samples, such as magnetic sensors and low-temperature bonding on flexible substrates, and received opportunities for business negotiations with many customers, which led to the next business activities. Thank you very much for coming.
Date: Wednesday, September 18 - Friday, September 20
Venue: Taipei Nangang Exhibition Center, TAIWAN
Booth: I2316

  • All
  • Information
  • Media
  • Event


User Centric Design

We will totally support your requests from assembling semiconductor chips, MEMS chips, surface mounting, module proto-typing, evaluation/analysis, reliability test, mass-production. We will also respond to request from clients in cooperation with our partner companies.