NEWS
event
Participated in IMAPS
16th International hosted by IMAPS (International Microelectronics Assembly and Packaging Society) of the Semiconductor Packaging Society The technical presentation of MONSTER PAC 10um was held at the Technical Session of Conference and Exhibition on DEVICE PACKAGING.
Yuji Komatsu, Director of the Advanced Development Division, explained the novel construction method and example 10um pitch wiring of the same shape as the master by intaglio replica, and attracted a great deal of attention.
It is a compact process to solve problems such as transmission speed, signal delay, signal purity, and large-scale investment, which have reached the technical limits of IoT/5G semiconductors in the future, and I felt a strong response with the interest of so many listeners.
We will continue to accelerate development and promote development in the future.
Dates: March 2- 5, 2020
Location: Arizona, Fountain Hills, And Wecopa Resort, USA
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Participated in the 33rd Nagano Implementation Forum
Attended the award ceremony of the Monozukuri Nippon Grand Prize
We have formed a strategic alliance with Mitsui Chemicals
We received the Minister of Economy, Trade and Industry Award at the Monozukuri Nippon Grand Prize
Exhibited at Semicon Japan 2019
CEO gave a lecture at the 80th anniversary ceremony of Kashiwazaki Technical High School
Thanks to you, we celebrated our 10th anniversary
Attended the award ceremony of the Monozukuri Nippon Grand Prize
We have formed a strategic alliance with Mitsui Chemicals
We received the Minister of Economy, Trade and Industry Award at the Monozukuri Nippon Grand Prize
Exhibited at Semicon Japan 2019
CEO gave a lecture at the 80th anniversary ceremony of Kashiwazaki Technical High School
Thanks to you, we celebrated our 10th anniversary
Presented at IMPACT-IAAC 2019
ICC Summit FUKUOKA 2018 Session 10DArticle Published
ICC Summit FUKUOKA 2018 Session 10DArticle Published
Published in Japan Finance Corporation PR magazine “Link to the Japan Corporation”
It was published in “pro-wise” of the Hitachi Solutions member magazine
NHK Flash light Niigata, telecasted on 2nd November, 2018
NHK WORLD JAPAN 「NEWS ROOM TOKYO」28th, September
NHK News Ohayo Nippon 12th September, 2018
Participated in IMAPS
Participated in the 33rd Nagano Implementation Forum
Attended the award ceremony of the Monozukuri Nippon Grand Prize
Exhibited at Semicon Japan 2019
CEO gave a lecture at the 80th anniversary ceremony of Kashiwazaki Technical High School
Presented at IMPACT-IAAC 2019
We held Seminar of the New Chemical Technology Promotion Association (JACI)
Participated in the Supporting Member Liaison Committee of the Semiconductor Industry Association
SERVICE
User Centric Design
We will totally support your requests from assembling semiconductor chips, MEMS chips, surface mounting, module proto-typing, evaluation/analysis, reliability test, mass-production. We will also respond to request from clients in cooperation with our partner companies.
