NEWS
event
Exhibited at SEMICON TAIWAN 2019
We exhibited at SEMICON TAIWAN, which we participated in last year, again this year. In the era of IoT, we exhibited the latest samples, such as magnetic sensors and low-temperature bonding on flexible substrates, and received opportunities for business negotiations with many customers, which led to the next business activities. Thank you very much for coming.
Date: Wednesday, September 18 - Friday, September 20
Venue: Taipei Nangang Exhibition Center, TAIWAN
Booth: I2316
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Participated in the Supporting Member Liaison Committee of the Semiconductor Industry Association
Exhibited at SEMICON TAIWAN 2019
Participated in the 18th Understanding Implementation Technology Course
ICC Summit FUKUOKA 2018 Session 10DArticle Published
Exhibited at SEMICON WEST 2019
Participated in the “Tech for Good” Innovation Summit sponsored by the French government
We exhibited at SmartSensing Exhibition2019
ICC Summit FUKUOKA 2018 Session 10DArticle Published
Article Publication Notice
【J-startup】Kick-off Meeting of Japan Association of Corporate Executives
Capital Tie-up with MITSUI & CO., LTD.
Exhibition Update
CAREERS
NextFlex is American consortium for developing Flexible Hybrid Electronics (FHE)
Our ‘one and only’ technology ‘Low temperature/Low load damage free bonding system We call our business style as 『OSRDA』。
ICC Summit FUKUOKA 2018 Session 10DArticle Published
Published in Japan Finance Corporation PR magazine “Link to the Japan Corporation”
It was published in “pro-wise” of the Hitachi Solutions member magazine
NHK Flash light Niigata, telecasted on 2nd November, 2018
NHK WORLD JAPAN 「NEWS ROOM TOKYO」28th, September
NHK News Ohayo Nippon 12th September, 2018
27th January, 2018 The Nikkei
19th Dec. 2017、NIKKAN KOGYO SHIMBUN, finger print sensor (click to enlarge)
We held Seminar of the New Chemical Technology Promotion Association (JACI)
Participated in the Supporting Member Liaison Committee of the Semiconductor Industry Association
Exhibited at SEMICON TAIWAN 2019
Participated in the 18th Understanding Implementation Technology Course
Participated in the “Tech for Good” Innovation Summit sponsored by the French government
We exhibited at SmartSensing Exhibition2019
Article Publication Notice
WE exhibited at 2019 FLEX JAPAN
SERVICE
User Centric Design
We will totally support your requests from assembling semiconductor chips, MEMS chips, surface mounting, module proto-typing, evaluation/analysis, reliability test, mass-production. We will also respond to request from clients in cooperation with our partner companies.
