NEWS
Exhibited at SEMICON WEST 2019
CONNECTEC JAPAN continued to exhibit at SEMICON WEST 2019 last year.The theme of the exhibition is 5G communications, MEMS manufacturing, and medical devices, which are CTJ's focus targets.Therefore, we exhibited an emphasis on the packaging and assembly process that CTJ has an advantage in.
We were able to talk more specifically and talk about the booth, and it was a very fruitful exhibition.
Thank you very much for coming.
Date: July 9 (Tue) - July 11 (Thu)
Venue: San Francisco, Moscone Center
NEWS CATEGORY
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Exhibited at SEMICON WEST 2019
Participated in the “Tech for Good” Innovation Summit sponsored by the French government
We exhibited at SmartSensing Exhibition2019
Article Publication Notice
WE exhibited at 2019 FLEX JAPAN
We participated IMAPS
We exhibited at FLEX2019
ICC Summit FUKUOKA 2018 Session 10DArticle Published
Article Publication Notice
【J-startup】Kick-off Meeting of Japan Association of Corporate Executives
Capital Tie-up with MITSUI & CO., LTD.
Exhibition Update
CAREERS
NextFlex is American consortium for developing Flexible Hybrid Electronics (FHE)
Our ‘one and only’ technology ‘Low temperature/Low load damage free bonding system We call our business style as 『OSRDA』。
ICC Summit FUKUOKA 2018 Session 10DArticle Published
Published in Japan Finance Corporation PR magazine “Link to the Japan Corporation”
It was published in “pro-wise” of the Hitachi Solutions member magazine
NHK Flash light Niigata, telecasted on 2nd November, 2018
NHK WORLD JAPAN 「NEWS ROOM TOKYO」28th, September
NHK News Ohayo Nippon 12th September, 2018
27th January, 2018 The Nikkei
19th Dec. 2017、NIKKAN KOGYO SHIMBUN, finger print sensor (click to enlarge)
Participated in the “Tech for Good” Innovation Summit sponsored by the French government
We exhibited at SmartSensing Exhibition2019
Article Publication Notice
WE exhibited at 2019 FLEX JAPAN
We participated IMAPS
We exhibited at FLEX2019
We attended Semicon Japan2018
We attended Deoitte Tohmatsu Innovation Summit
SERVICE
User Centric Design
We will totally support your requests from assembling semiconductor chips, MEMS chips, surface mounting, module proto-typing, evaluation/analysis, reliability test, mass-production. We will also respond to request from clients in cooperation with our partner companies.
