CASEDevelopment Example
Connectec Japan has responded to various requests from many customers.
Depending on the bonding style of semiconductor chips, DRAM, sensors, modules, etc., various substrate materials such as ceramics, organic, and film are used in low-temperature, low-load damage-free processes.
Please leave it to our experienced Connectec Japan.
Development Example
| OSRDA Contract Development Case | Contract Overview | Special Stipulations |
|---|---|---|
| 140℃ heat-resistant magnetic sensor for battery inspection High density bonding | A 140℃ heat-resistant magnetic sensor is high-density bonded to realize a two-dimensional magnetic sensor array. | MONSTER PAC® 120°C low temperature bonding |
| COF board mounting for bonding MEMS sensors | To the FPC substrate sensor unit is opened, the MEMS sensor chip of length 40mm is implemented as a flip chip bonding. | MONSTER PAC® low temperature bonding |
| Ceramic substrate bonding for inner ear hearing aids | A medical cochlear implant ASIC is mounted on a ceramic substrate with a flip chip bonding. | High reliability/MONSTER PAC® 170℃ low temperature bonding |
| High-precision bonding of VCSEL chip FPC board | The VCSEL chip is bonded on the FPC board. | MONSTER PAC® 80℃ low temperature bonding |
| Bonding of thermally vulnerable LSI chip | Bond an LSI chip that is sensitive to heat to the substrate. | MONSTER PAC® 80°C low temperature bonding |
| Narrow gap bonding of large area sensors | Four 12mm□ LSI chips are implemented with a gap of 30um to achieve a set sensor. | MONSTER PAC® 170°C low temperature bonding |
| High Yield CoC for DRAM and CPU | The DRAM is bonded on the CPU and bonded on the board. | MONSTER PAC® 170°C low temperature bonding |
| Contract development of all processes | Board design – board manufacturing -bonding further waterproofing. | Connectec Japan One-stop contract development |
| RF Modules | 1 package of RF+ baseband + FlashROM | Ultra-small bonding with shield case |
| SAW devices | Flip chip bonding of SAW devices | Hollow sealing package |
| Sensor Devices | Flip chip mounting of none high-temperature resistance sensor | MONSTER PAC® 170°C low temperature bonding |
| Optical Switch Devices | Flip chip bonding of optical switches | Multi-pin area array MONSTER PAC® 170°C low temperature bonding |
| DRAM Package | Flip chip bonding of DDR3 memory chip | Thin sealing package |
| CoC (chip-on-chip) | Flip chip bonding on chip | Chip gap within 10μm MONSTER PAC® 170°C low temperature bonding |
| ASIC Composite Module | 2-chip 1 package flip chip bonding | Multi-pin bonding on 16-layer LTCC substrates |
| Automotive Reliability Evaluation TEG | Area Array TEG Chip + Organic Board Flip Chip Bonding | Multi-pin area array MONSTER PAC® 170℃ low temperature bonding |
| High Voltage Evaluation TEG | Peripheral TEG Chip + Cera Board Flip Chip Bonding | Multi-pin area array MONSTER PAC® 170℃ low temperature bonding |
| Solder FCBGA prototype | Flip chip bonding of solder bumped chip | Pulse heat local reflow mountaning |
| Image Sensor | Ultrasonic FC junction after stud bumping into bare chip | Ultrasonic bonding |
| Wafer ENIG processing | ENIG (Electroless Ni/Au Plating) processing on MEMS wafers | ENIG, dicing and taping support |
OSRDA Development Example: High-density bonding of 140℃ heat-resistant magnetic sensors
OSRDA Development Examples: COF board bonding of MEMS sensor
OSRDA Development Example: Ceramic substrate bonding for inner ear hearing aids
※High reliability package for medical devices
OSRDA Development Example: High-precision bonding of VCSEL chip FPC board
OSRDA Development Example: Bonding of thermally vulnerable LSI chip
OSRDA Development Example: Narrow gap bonding of large area sensors
OSRDA Development Example: High Yield CoC for DRAM and CPU
OSRDA Development Example: Contract development of all processes
I want the FPC board to install temperature sensors, microcontrollers, radio modules, and batteries, and finally waterproof.
Conventional
Conventionally, after planning in the customer, when outsourcing the subsequent processes, for example, substrate design company, substrate manufacturing board manufacturer, such as the mounting of sensors and parts is entrusted to the mounting contract company, the customer itself it was necessary to control another consignment for each step.
Contract development of Connectec Japan OSRDA
Connectec Japan’s OSRDA contract development provides a one-stop response to all customer requests.
If you have any problems or plan/idea, please leave everything from board design to board manufacturing, bonding, and special processing such as waterproofing to Connectec Japan.
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