CASEDevelopment Example
We have been responding to a variety of requests so far. Semiconductor chips and DRAM, sensor, depending on the implementation of the module, using a variety of substrate materials such as ceramic, organic, film, etc. achieved by the damage-free process with low temperature and low load.Please rely on our experienced Connectec Japan.
【Contracted projects】Magnetic Sensor
| Contents | Features |
|---|---|
| 2d Magnetic Sensor Array | Low temperature assembly |
【Contracted projects】 Medic MEMS Sensor
| Contents | Features |
|---|---|
| 40mm Length MEMS : flip chip bonding on Flexible Printed Circuit(FPC) | Low temperature assembly |
【 Contracted projects 】Medical Cochlear implant ASIC
| Contents | Features |
|---|---|
| Ceramic board flip chip package | High reliability |
RF Module
| Issues | Advantages |
|---|---|
| Integrating RF,Bseband and Flash ROM in a packge | Small package with shield case |
SAW filter
| Issues | Advantages |
|---|---|
| Flip-chip assembly of magnetic SAW filters | Cavity structure package |
Sensors
| Issues | Advantages |
|---|---|
| Flip-chip assembly of no heat resistant sensors | 170 deg Clow temperature assembly |
Optical switches
| Issues | Advantages |
|---|---|
| Flip-chip assembly of optical sensors | Multi-pin area-array,low temperature assembly |
DRAM Packaging
| Issues | Advantages |
|---|---|
| Flip-chip assembly of DDR3 DRAM Chips | Thin package |
Chip on Chip
| Issues | Advantages |
|---|---|
| Flip-chip assembly of on-chip assembly | 10um gap between chips |
Integrated Sensors
| Issues | Advantages |
|---|---|
| 4 Sensors integrated into one large sensor w/30um gap | Low temperature 30um gap assembly |
ASIC combined module
| Issues | Advantages |
|---|---|
| Flip-chip assembly of 2 chips in a package | Multi-pin assembly onto 16 layer LTCC substrates |
Reliability TEG for automobile
| Issues | Advantages |
|---|---|
| Flip-chip assembly of area-array TEG chips on organic substrates | Multi-pin area-array,low temperature assembly |
TEG for high voltage device
| Issues | Advantages |
|---|---|
| Flip-chip assembly of chips with solder bumps | Pulse heat,local reflow available |
Solder FCBGA
| Issues | Advantages |
|---|---|
| Flip-chip assembly of chips with solder bumps | pulse heat,loval reflow available |
Image Sensors
| Issues | Advantages |
|---|---|
| Ultrasonic Flip-chip bonding after stud-bumps on bare chips | Ultrasonic bonding |
Wafer ENIG process
| Issues | Advantages |
|---|---|
| ENIG treatment on MEMS wafers | ENIG,Dicing,Taping available |
