CASEDevelopment Example

We have been responding to a variety of requests so far. Semiconductor chips and DRAM, sensor, depending on the implementation of the module, using a variety of substrate materials such as ceramic, organic, film, etc. achieved by the damage-free process with low temperature and low load.Please rely on our experienced Connectec Japan.

【Contracted projects】Magnetic Sensor

Contents Features
2d Magnetic Sensor Array Low temperature assembly

【Contracted projects】 Medic MEMS Sensor

Contents Features
40mm Length MEMS : flip chip bonding on Flexible Printed Circuit(FPC) Low temperature assembly

【 Contracted projects 】Medical Cochlear implant ASIC

Contents Features
Ceramic board flip chip package High reliability

RF Module

Issues Advantages
Integrating RF,Bseband and Flash ROM in a packge Small package with shield case

SAW filter

Issues Advantages
Flip-chip assembly of magnetic SAW filters Cavity structure package

Sensors

Issues Advantages
Flip-chip assembly of no heat resistant sensors 170 deg Clow temperature assembly

Optical switches

Issues Advantages
Flip-chip assembly of optical sensors Multi-pin area-array,low temperature assembly

DRAM Packaging

Issues Advantages
Flip-chip assembly of DDR3 DRAM Chips Thin package

Chip on Chip

Issues Advantages
Flip-chip assembly of on-chip assembly 10um gap between chips

Integrated Sensors

Issues Advantages
4 Sensors integrated into one large sensor w/30um gap Low temperature 30um gap assembly

ASIC combined module

Issues Advantages
Flip-chip assembly of 2 chips in a package Multi-pin assembly onto 16 layer LTCC substrates

Reliability TEG for automobile

Issues Advantages
Flip-chip assembly of area-array TEG chips on organic substrates Multi-pin area-array,low temperature assembly

TEG for high voltage device

Issues Advantages
Flip-chip assembly of chips with solder bumps Pulse heat,local reflow available

Solder FCBGA

Issues Advantages
Flip-chip assembly of chips with solder bumps pulse heat,loval reflow available

Image Sensors

Issues Advantages
Ultrasonic Flip-chip bonding after stud-bumps on bare chips Ultrasonic bonding

Wafer ENIG process

Issues Advantages
ENIG treatment on MEMS wafers ENIG,Dicing,Taping available
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