COMPANYcompany

History

2018-06
Ministry of Economy, Trade and industry J-startup Program Selection
one of nationwide 97 Certified Companies
2018-04
Investment from Dai-ichi life insurance Company
2018-02
Investment from Mitsui&Company
2017-07
Opened an office in Akihabara, Tokyo
2017-07
Established a US base in NextFlex (NextFlex is a Flexible Hybrid Electronics (FHE) consortium sponsored by the United States government, which is designed to create greater innovation in the market)
2017-01
Investment from Niigata Venture Capital
2017-01
Investment from LeadinWay.
2017-01
Investment from Nidec Corporation
2016-11
Investment from Real Tech Fund
2016-09
Bonding Temperature120°c achieved
2016-07
Capital is increased to \525,266,700(JPY)
2015-12
Opened a sales branch in Silicon Valley in the United States.
(CONNECTEC AMERICA)
2015-10
Released DTF #1.
2015-08
The first DTF Flip Chip Bonder completed
2015-06
Business partnership with Fujikin Co., Ltd.
2014-12
Investment from Shinsei Bank
2014-12
Business alliance with MEMS Core, Inc.
2014-09
Bonding Temperature150°c achieved
2014-07
Investment from TNP On The Road Co.,Ltd. (Venture Capital)
2013-06
Relocation of CONNECTEC KOREA Office
2013-06
MSIVC2008V Investment Business Limited Partnership Mitsui Sumitomo Insurance Capital Corporation
2013-03
Agent agreement with Chinese Semiconductor company, Jcap and commence sales promotion of its WLCSP and RDL ,etc. in Japanese domestic market.
2012-11
Investment from KSP Co. Ltd. As KSP 3 Business Limited Partnership Unlimited partner
2012-09
Establish office in ITRI Open-Lab Taiwan to have close contact with Taiwan customers and accelerate technological development and production expansion in
* ITRI (Industrial Technology Research)
2012-08
Investment from NEC Capital Solutions Co., Ltd. And SMBC Venture Capital Co., Ltd. As Innovation Venture Investment limited for business. Unlimited Liability Union member.
2012-08
Investment from Mizuho Capital Co., LTD as 3rd Mizuho Capital limited Business Investment Union. Unlimited liability Union member.
2012-07
Certified as third “specific development plan” based on the Act on the Advancement of Manufacturing PCB technology for small and middle-sized enterprises in the Ministry of Economy, Trade and industry (Theme name: Ultra high density and damage-free bonding technology using soft bumps and development of next-generation semiconductor package
2012-06
Established CONNECTEC Corporation (Office in TAIWAN)
2012-06
Investment from Daishi Management Consulting Co., Ltd. (Venture Capital) as Daishi
Corporate incubation fund project.
2012-05
Investment from Neo Stella Capital Co., Ltd. (Venture Capital) as first Neo Stella investment project.
2012-03
NEDO(New Energy and Industrial Technology Development Organization) subsidy project for Practical development of industrial technology for year 2010~2012. Project completed on 2nd February of 2012 and received the subsidy (payment).
2012-03
Completed 2011 “New Foundation support subsidy” project of Niigata Industrial Creation organization on 29th February, 2011. Receive a grant (payment)
2012-01
Investment from Namics Co., Ltd.
2011-07
Signed license agreement with ChipMOS TECHNOLOGIES in Taiwan for joint development and comprehensive Business Alliance including investment
2011-04
Niigata Industrial Creation organization. Year 2012 newly established project support subsidy confirmed.
2011-03
Investment from SIP Co., Ltd. (Venture Capital) as digital convergence investments.
2011-03
Investment from Niigata Venture Capital Co., Ltd. (Venture Capital) as the first Niigata Incubation Fund Investment.
2011-03
Completed 2010 “New Foundation support subsidy” project of Niigata Industrial Creation organization on 28th February 2010. Receive a grant (payment)
2011-02
Completed development subsidy project of the national small and medium-sized Enterprises Association of Japan on 31st December, 2010 as planed. Receive a grant (payment)
2010-11
MonsterPAC TypeC Sample First shipment (to Korean DSP manufacturer)
2010-09
Bonding Temperature170°c achieved
2010-07
The national small and medium-sized business organization Central meeting “subsidy for development of products for small and medium Enterprises” grant decision and theme name: Development of fine pitch connection technology for display driver package
2010-07
NEDO Grant decision and theme name of “Innovation practical development cost subsidy”: Practical development of fine pitch high performance tape carrier package
2010-06
METI certified as a “specific development plan” based on the Act on the Advancement of Manufacturing Board technology for small and medium-sized enterprises. Theme Name: High performance and fine pitch COF of the package Development
2010-05
MonsterPAC Type F Sample First shipment (to Korean LCD driver manufacturer)
2010-05
Received the subsidy from Niigata Industrial Creation Organization, as support for new innovative founder.
2010-03
Opened offices in Korea and China.
2010-03
The “specific research and development plan” based on the Act on the Advancement of Manufacturing Board technology for small and middle-sized enterprises of the Ministry of Economy, Trade and industry: Development of high-performance semiconductor package using high-density mounting technology
2009-11
Established CONNECTEC JAPAN CORPORATION
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