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event 2018.03.06

Semicon China 2018

March 14th Wednesday – 16th Friday, 2018
Come and visit our booth!!

 

Seminar

 

7 Challenges to the World’s First Technology
1. MONSTER PAC 80‐170℃ Flip Chip Bonding
2. OSRDA Business Model
3. MONSTER DTF Desk Top Factory
4. MONSTER PAC 10um pitch Flip Chip Bonding
5. MONSTER PAC 80℃ Flip Chip Bonding using PET film
6. The world’s smallest MEMS wide range pressure sensor
7. Built-in display large sized and clear finger print sensor

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