OSRDAOSRDA

Research and Development

Entrusted development corresponding to various kinds of semiconductor assembly is possible.

Our major assembly machines are wafer dicer, printing machine, flip-chip bonder. We also have equipment for quality control such as X-ray spectrometer, secondary electron microscope with EDAX, heat-cycling tester and so on. In addition, we can respond your any request in cooperation with our partner companies.

Stud Bump Bonding

Facility
  • Sud Bump Bonder

Printing

Facility
  • Stencil Printing Machine

Dicing

Facility
  • Blade Dicer

Dispensing

Facility
  • Dispenser

Flip Chip Bonding

Facility
  • Desk Top Flip chip bonder
Facility
  • Manual Flip Chip Bonder
Facility
  • High speed Flip Chip Bonder
Facility
  • Full Automatic Flip Chip Bonder
Facility
  • Semi Automatic Flip Chip Bonder
Facility
  • Ultrasonic Flip Chip Bonder

Reflow・Bake・Oven

Facility
  • N2 Reflow Oven
Facility
  • Cure Oven

Evaluation・Analysis

Facility
  • SEM/EDX
Facility
  • X-ray Inspection System
Facility
  • IR Microscope
Facility
  • High Speed Camera
Facility
  • Shear Tester
Facility
  • Leaser Measuring System
Facility
  • Laser Measuring System
Facility
  • Automatic Grinder
Facility
  • HT/THB Oven
Facility
  • Thermal Cycle Oven
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