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MONSTER PAC 10um

10um fine pitch bonding system
MONSTER PAC 10um

Many countries are in a race to develop 5G communication service by 2020. CONNECTEC JAPAN is able to make key device minituarization for 5G. For that purpose, we are developing connection technology with 10um pitch, called MONSTER PAC 10um. conventional bonding temperature and Min. pitch. MONSTER PAC 10um development target, shrink chip as 75% possible.

R&D concept 「to minimize 5G product size」

  • Solution to problems of conventional technology
  • The world’s first MONSTER PAC 10um
  • Challenge to the best miniaturizationand cost performance

MONSTER PAC 10um

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Conventional solder joint process : min. pitch is 40um. Because solder joint temperature is 260℃. Thermal expansion is big.
Wafer process rule can reduce more and more, but die size can not shrink.

The world’s first bump/trace pitch 10um

Connectec Japan are developing MONSTER PAC-10um, the world’s first technology, narrow pitch bonding.

MONSTER PAC 10um Development Target

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To shrink chip size to 75%

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MONSTER PAC bonding temperature is 130℃.
Min Bonding pitch is 10um.

MONSTER PAC-10um can shrink the die size 75%.

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