MONSTER PAC® Core Technology
- Development and Support
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- MONSTER PAC® Core Technology
- DTF for Industry 4.0
Bump On Material and Damage Free BondingOur MONSTER PAC® is the world’s first and original cutting-edge technology.
MONSTER PAC® : Bump On Material
Conventional Flip Chip : Bump On Wafer
Bump On MaterialBumps are formed on the materials.Conjunctions are performed by conductive paste.
Bump On WaferBonding takes place with low temp.low load. Strong and sufficient adhesion. Our low temp.low load ‘damage free’ bonding is the only answer to the fragile 5G requirement.
Due to Low-k device,
high speed, more functions requirement for LSI, circuit design rule is getting finner and narrower. To control capacity between layers as low to meet high speed, insulator between layers is getting more porous and weaker against mechanical damage. CONNECTEC JAPAN’s MONSTER PAC® ‘damage free’ bonding can process such ‘Low-k’ insulation layers without damage while conventional bonding cannot process ‘Low-K’ device without damage.