OSRDAOutsourced Semiconductor Reserch, Development & Assembly
- flip chip bonding
new process development
Outsourced Semiconductor Reserch,
Development & Assembly
CONNECTEC engineers have good experience and technologies.
And we have wide selection of substrate materials, i.e. ceramic, organic, film, etc. for various semiconductor devices, DRAM, sensor and module, and build them with low temp./low load ‘damage free’ process.