SERVICEService

OSRDAOutsourced Semiconductor Reserch, Development & Avssembly

We serve to design any kind of devices and modules, etc.

We offer ‘one stop R&D’ for device construction proposal, design, process proposal,
Prototype building, reliability testing, and volume production.

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customer/CONNECTEC JAPAN

document/inquiry wafer

CONNECTEC JAPAN

Process
MONSTER PAC
  • print
  • dispense
  • flip chip bonding
new process development
  • OSRDA
    Outsourced Semiconductor Reserch,
    Development & Assembly
Ceramic flex circuit combo package

customer

Super computer ultrasound probe automotive communication base station wearable

CONNECTEC engineers have good experience and technologies.

And we have wide selection of substrate materials, i.e. ceramic, organic, film, etc. for various semiconductor devices, DRAM, sensor and module, and build them with low temp./low load ‘damage free’ process.

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Produce & promote

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CONTACT