Company

History

Company History

Technology History


2023-12

Acquired ISO9001 & ISO14001 certification


2020-11

Received the Ministry of Economy, Trade and Industry’s Small and Medium Enterprise Agency’s “300 Small and Medium Enterprises and Small Businesses” in the “Manufacturing and Productivity” category.


2019-12

Received the Minister of Economy, Trade and Industry Award in the Manufacturing/Production Process Category at the 8th Monodzukuri Nippon Grand Prize


2018

Achieved junction temperature of 80℃


2018-06

Certified as one of 97 companies nationwide selected for the Ministry of Economy, Trade and Industry’s “J-Startup Program”


2017-07

Opened base in Akihabara


2017-07

Opened base in Next Flex, USA
(NextFlex is a U.S. government-sponsored consortium created with the aim of creating even greater innovation in the rapidly growing market of Flexible Hybrid Electronics (FHE).)


2016-09

Achieved junction temperature of 120℃


2015-12

Opened a sales branch in Silicon Valley, USA (CONNECTEC AMERICA)


2015-08

First generation DTF flip chip bonder completed


2015-06

Business partnership with Fujikin Co., Ltd.


2014-12月

Business partnership with Mems Core Co., Ltd.


2014-09

Achieved junction temperature of 150℃


2013-06

CONNECTEC KOREA office relocated


2013-03

Signed an agent contract with jcap in China and started handling WLCSP, RDL, etc. in Japan.


2012-09

Opened Taiwan office
A new office will be established at the Industrial Technology Research Institute of Taiwan (ITRI) Open-Lab in order to have close contact with Taiwanese companies and accelerate technology development and production expansion in Taiwan.
*ITRI(Industrial Technology Research Institute)


2012-07

Certified as a “specific development plan” based on the Ministry of Economy, Trade and Industry’s Act on the Advancement of Manufacturing Board Technology for Small and Medium Enterprises (3rd case)
Theme name: Development of ultra-high-density, damage-free bonding technology and next-generation semiconductor packages using soft bumps


2012-06

Established CONNECTEC Corporation (Taiwanese subsidiary)


2012-03

The New Energy and Industrial Technology Development Organization (NEDO)’s “Industrial Technology Practical Development Cost Subsidy Project” from 2010 to 2012 was completed on February 29, 2012. Receive a grant (payment)


2011-07

Signed a comprehensive business partnership agreement with ChipMOS TECHNOLOGIES in Taiwan, including licensing, joint development, and investment from our company.


2010-11

First shipment of MONSTER PAC® typeC samples (for Korean DSP manufacturers)


2010-09

Achieved junction temperature of 170℃


2010-06

Certified by the Ministry of Economy, Trade and Industry as a “Specific Development Plan” based on the Act on the Advancement of Manufacturing Board Technology for Small and Medium Enterprises
Theme name: Development of high performance/fine pitch COF package


2010-05

First shipment of MONSTER PAC® typeF samples (to Korean LCD driver manufacturer)


2010-03

Opened Korean office
Opened China office


2010-03

Certified as a “Specific Research and Development Plan” based on the Ministry of Economy, Trade and Industry’s Act on the Advancement of Manufacturing Board Technology for Small and Medium Enterprises
Theme name: Development of high-performance semiconductor packages using high-density packaging technology


2009-11

Established Connectec Japan Co., Ltd.