Company
History
Company History
Technology History
2023-12
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Acquired ISO9001 & ISO14001 certification
2020-11
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Received the Ministry of Economy, Trade and Industry’s Small and Medium Enterprise Agency’s “300 Small and Medium Enterprises and Small Businesses” in the “Manufacturing and Productivity” category.
2019-12
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Received the Minister of Economy, Trade and Industry Award in the Manufacturing/Production Process Category at the 8th Monodzukuri Nippon Grand Prize
2018
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Achieved junction temperature of 80℃
2018-06
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Certified as one of 97 companies nationwide selected for the Ministry of Economy, Trade and Industry’s “J-Startup Program”
2017-07
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Opened base in Akihabara
2017-07
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Opened base in Next Flex, USA
(NextFlex is a U.S. government-sponsored consortium created with the aim of creating even greater innovation in the rapidly growing market of Flexible Hybrid Electronics (FHE).)
2016-09
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Achieved junction temperature of 120℃
2015-12
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Opened a sales branch in Silicon Valley, USA (CONNECTEC AMERICA)
2015-08
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First generation DTF flip chip bonder completed
2015-06
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Business partnership with Fujikin Co., Ltd.
2014-12月
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Business partnership with Mems Core Co., Ltd.
2014-09
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Achieved junction temperature of 150℃
2013-06
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CONNECTEC KOREA office relocated
2013-03
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Signed an agent contract with jcap in China and started handling WLCSP, RDL, etc. in Japan.
2012-09
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Opened Taiwan office
A new office will be established at the Industrial Technology Research Institute of Taiwan (ITRI) Open-Lab in order to have close contact with Taiwanese companies and accelerate technology development and production expansion in Taiwan.
*ITRI(Industrial Technology Research Institute)
2012-07
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Certified as a “specific development plan” based on the Ministry of Economy, Trade and Industry’s Act on the Advancement of Manufacturing Board Technology for Small and Medium Enterprises (3rd case)
Theme name: Development of ultra-high-density, damage-free bonding technology and next-generation semiconductor packages using soft bumps
2012-06
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Established CONNECTEC Corporation (Taiwanese subsidiary)
2012-03
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The New Energy and Industrial Technology Development Organization (NEDO)’s “Industrial Technology Practical Development Cost Subsidy Project” from 2010 to 2012 was completed on February 29, 2012. Receive a grant (payment)
2011-07
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Signed a comprehensive business partnership agreement with ChipMOS TECHNOLOGIES in Taiwan, including licensing, joint development, and investment from our company.
2010-11
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First shipment of MONSTER PAC® typeC samples (for Korean DSP manufacturers)
2010-09
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Achieved junction temperature of 170℃
2010-06
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Certified by the Ministry of Economy, Trade and Industry as a “Specific Development Plan” based on the Act on the Advancement of Manufacturing Board Technology for Small and Medium Enterprises
Theme name: Development of high performance/fine pitch COF package
2010-05
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First shipment of MONSTER PAC® typeF samples (to Korean LCD driver manufacturer)
2010-03
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Opened Korean office
Opened China office
2010-03
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Certified as a “Specific Research and Development Plan” based on the Ministry of Economy, Trade and Industry’s Act on the Advancement of Manufacturing Board Technology for Small and Medium Enterprises
Theme name: Development of high-performance semiconductor packages using high-density packaging technology
2009-11
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Established Connectec Japan Co., Ltd.