A 140℃ heat-resistant magnetic sensor is high-density bonded to realize a two-dimensional magnetic sensor array.
To the FPC substrate sensor unit is opened, the MEMS sensor chip of length 40mm is implemented as a flip chip bonding.
A medical cochlear implant ASIC is mounted on a ceramic substrate with a flip chip bonding.
The VCSEL chip is bonded on the FPC board.
Bond an LSI chip that is sensitive to heat to the substrate.
Four 12mm□ LSI chips are implemented with a gap of 30um to achieve a set sensor.
The DRAM is bonded on the CPU and bonded on the board.
Board design – board manufacturing - bonding further waterproofing.
1 package of RF+ baseband + FlashROM
Flip chip bonding of SAW devices
Flip chip mounting of none high-temperature resistance sensor
Flip chip bonding of optical switches
Flip chip bonding of DDR3 memory chip
Flip chip bonding on chip
2-chip 1 package flip chip bonding
Area Array TEG Chip + Organic Board Flip Chip Bonding
Peripheral TEG Chip + Cera Board Flip Chip Bonding
Flip chip bonding of solder bumped chip
Ultrasonic FC junction after stud bumping into bare chip
ENIG (Electroless Ni/Au Plating) processing on MEMS wafers
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