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2024.12.03

We held a press briefing on the commercialization of our TSV/RDL business.

On December 3 (Tuesday), a press briefing was held in Otemachi, Tokyo, regarding the commercialization of our TSV/RDL business. The briefing was conducted by our Chairman Hirata and Managing Director Shimoishizaka. Many media outlets attended, and an active Q&A session followed the explanations.

Please refer to the following links for media coverage:

  • December 3, Nikkei Electronic Edition
    “Connectech Japan to Establish a New Line for AI/IoT Semiconductors”
    https://www.nikkei.com/article/DGXZQOUC032L80T01C24A2000000/

  • December 3, 3rd News
    “Connectech Japan to Launch the World’s First TSV/RDL Contract Development Service by 2025”
    https://news.3rd-in.co.jp/article/fa74acfc- b126-11ef-87c0-9ca3ba083d71#gsc.tab=0

  • December 4, Nikkan Kogyo Shimbun
    “Connectech Japan to Begin Advanced Packaging Contract Manufacturing Next Spring”
    https://www.nikkan.co.jp/articles/view/00733201

  • December 5, EE Times Japan
    “TSV/RDL Contract Development to Accelerate the Emergence of ‘Next NVIDIA'”https://eetimes.itmedia.co.jp/ee/articles/2412/05/news171.html

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HomeニュースWe held a press briefing on the commercialization of our TSV/RDL business.