News

We participated in “SEMICON JAPAN 2024,” held at Tokyo Big Sight from Wednesday, December 11, to Friday, December 13, 2024.

We extend our heartfelt gratitude to the many visitors who came to our booth and engaged with us in numerous inquiries and business discussions.

This year, our exhibit centered around the theme of our December 3rd press announcement, “World’s First Comprehensive Contract Development and Manufacturing Service for TSV/RDL and Assembly in Advanced Chiplet Packaging, Launching April 2025.” Many visitors showed great interest in our technological development aimed at achieving TSVs with a diameter of 1µm and 4-layer RDL, as well as our unique business approach to offering one-stop services, from TSV/RDL to assembly, even for single wafers. We have also received specific inquiries post-event.

Additionally, the number of assembly contract projects we handled surpassed 400 annually for the first time in our 15-year history.

At this exhibition, we showcased real-world examples of our chiplet-centered technologies, including millimeter-wave, optoelectronic integration, sensing devices, and materials evaluation, with significant cooperation from our customers. This allowed us to present more examples than in previous years.

We are truly delighted and honored by the significant interest shown in our efforts. To meet the expectations of our stakeholders, we are committed to further advancing our business initiatives as one united team.

We kindly ask for your continued support and patronage.

A video showcasing our booth during the exhibition has been uploaded to YouTube. Please feel free to check it out!