We will exhibit at SEMICON Japan 2025

CONNECTEC JAPAN will exhibit at SEMICON JAPAN 2025, to be held at Tokyo Big Sight from December 17 (Wed) to 19 (Fri), 2025.

Amid the growing chiplet packaging market — fueled by advances in high-performance AI and optoelectronic convergence devices — CONNECTEC JAPAN has launched a new initiative this year: the CADN (Chiplet Ameba Development Network). This service is designed to connect semiconductor-related companies across Japan in optimal combinations, enabling the realization of every type of chiplet structure.

Building on the “Produce & Promote” concept developed through our OSRDA business model, CADN functions as a flexible, ameba-like network that connects semiconductor companies across Japan. This agile collaboration enables the creation of a wide variety of cutting-edge chiplet packages tailored to each project — turning your vision into reality.

【POINT ①】 CONNECTEC JAPAN serves as a partner for small-lot development and production. In the early stages of research and development, when only a few to several dozen prototypes are required, it is often difficult to request large-scale foundries or OSATs that focus on mass production. At CONNECTEC JAPAN, even a single wafer or TSV process alone can be handled on a consignment basis.

【POINT ②】 We can accommodate a wide variety of chiplet package structures and processes. Chiplet package structures vary greatly depending on factors such as the presence or absence of TSV/TGV/RDL, the type of base substrate and interlayer dielectric, the number of wiring layers, the presence of planarization, and the wiring materials used. Therefore, it is difficult for the standardized, integrated lines of major foundries and OSATs to support all variations. CONNECTEC JAPAN supports the realization of diverse structures and processes envisioned by customers to achieve high performance and high added value, contributing to their differentiation in the market.

At this exhibition, we will showcase our new CADN (Chiplet Ameba Development Network) initiative, along with a variety of our latest solutions — including examples of compact, high-performance assemblies utilizing flip-chip technology and advanced materials. We look forward to welcoming you at our booth.

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■Date and time

December 17th (Wed.) – December 19th (Fri.), 2025

10:00-17:00

■Venue

Tokyo Big Sight

East Hall 4 Booth No.E4022

■How to register

This exhibition requires advance registration.

Please register at the link below.

👉Visitor registration

https://www.semiconjapan.org/jp/about/pricing-and-register

✨VIP registration (manager and above), please  enter invitation ID.

invitation ID【77986】

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