Exhibiting at 2nd NEPCON JAPAN [Kansai]

CONNECTEC JAPAN to Debut at the 2nd NEPCON JAPAN [Kansai]

CONNECTEC JAPAN is pleased to announce our first-ever participation in the 2nd NEPCON JAPAN [Kansai] — Electronics Manufacturing & Packaging Exhibition, held at INTEX Osaka starting Wednesday, May 13, 2026.

 At our booth, we will showcase the latest solutions designed to address the diversifying challenges of semiconductor packaging, including highly discussed topics such as Chiplets and Photonics-Electronics Convergence.

 ■ Key Highlights and Services

“OSRDA”: Our development-oriented business model, supporting everything from a single prototype to mass production.

 “CADN”: Integrated contract development and manufacturing services for TSV/RDL and Chiplet integration.

 Packaging Case Studies: Real-world examples of Flip Chip assembly and compact, high-performance packaging utilizing advanced materials.

 We have prepared a wide range of technologies and services to help solve your technical challenges. We cordially invite you to visit our booth.

 【Event Overview】

Exhibition Name: 2nd NEPCON JAPAN [Kansai] — Electronics Manufacturing & Packaging Exhibition

 Dates: May 13 (Wed) – 15 (Fri), 2026 | 10:00 AM – 5:00 PM

 Venue: INTEX Osaka

 Booth Number: Hall 6, Zone B 【K36-18】

■ Pre-registration (Free of Charge)

Pre-registration is required for each visitor to enter the exhibition.

Please complete your registration via the following URL:

👉 General Visitor Registration

https://www.nepconjapan.jp/osaka/ja-jp/register.html?code=1650372718713573-I3J

 👉 VIP Visitor Registration (For Manager level or above)

https://www.nepconjapan.jp/osaka/ja-jp/register.html?code=1650372718907842-1LY

 We look forward to welcoming you to our booth.