Invitation to SEMICON West 2026
Thank you for your continued support and partnership.
We are pleased to announce that Connectec Japan Corporation will be exhibiting at SEMICON West 2026 in San Francisco, USA.
At this exhibition, we will introduce our latest packaging technologies for “Photonics-Electronics Convergence,” a key to next-generation semiconductors. We will also showcase the global expansion of C2ADN (CPO & Chiplet Ameba Development Network), the world’s first turnkey contract development and manufacturing business model for chiplet packaging.
With a proven track record of over 400 contract development projects annually, we leverage proprietary technologies such as MONSTER PAC, which enables low-temperature and low-load packaging for heat- and pressure-sensitive devices. We will present our latest solutions and concrete case studies to demonstrate how our integrated contract business model can seamlessly support you from any entry point—whether you need prototyping for new material evaluation, commercialization, or mass production support.
We understand you have a busy schedule, but we would be highly honored if you could stop by our booth. Our team sincerely looks forward to welcoming you.
■ Exhibition Overview
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Event: SEMICON West 2026
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Dates: Tuesday, October 13 – Thursday, October 15, 2026
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Venue: Moscone Center (San Francisco, CA, USA)
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Our Booth: North Hall / Booth #5338
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Exhibition Highlights:
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Packaging technology solutions for photonics-electronics convergence contract development.
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Introduction of the “C2ADN” turnkey business model for CPO & Chiplet packaging.
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Case studies on solving the latest packaging challenges regarding modules, materials, and equipment.
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■ Visitor Registration Prior registration is required to enter the exhibition. Please register through the official SEMICON West website below: