Contract development

OSRDA

OSRDA stands for Outsourced Semiconductor Research Development and Assembly.It is the world’s first business model.

The world’s first business model OSRDA

【Semiconductor Contract Business】 Capable of variable and multi-product assembly

Capable of variable and multi-product assembly

Entrusted Development Service Procedure

We will offer it on a one-stop basis from structure design until sample preparation.

We will totally support your requests from assembling semiconductor chips, MEMS chips, surface mounting, module proto-typing, evaluation/analysis, reliability test, mass-production.
By connecting all the technologies of the Japan, which is the origin of our company name, We provide comprehensive support for semiconductor chip, not only MEMS chip, PCB mounting, module prototyping, sample prototyping, evaluation and analysis, reliability evaluation, and mass production. In cooperation with affiliated companies, research institutes, universities, etc., we provide services to meet your needs.
We will also respond to request from clients in cooperation with our partner companies.

OSRDA From order to mass production

order to mass production

Independent Development

Independent Development

Concept Structure/
Process Design
Trial Evaluation Mass Production

Entrusted Development

Concept Structure/
Process Design
Trial Evaluation Mass Production
Customer Consultionl Consultionl

Joint Development

Concept Structure/
Process Design
Trial Evaluation Mass Production
○/Customer ○/Customer Consultionl Consultionl

Trial Manufacture

Concept Structure/
Process Design
Trial Evaluation Mass Production
○/Customer ○/Customer Consultionl Consultionl

Produce and Promote

Proto-typing Process Menu

Responding to all your requirement, Semiconductor chips and modules, ceramic, organic, film, etc., can be applied to various substrate materials. In addition to the process, we offer a variety of MonsterPAC menu, the process that best suits your needs and implementation structure.

Major Examples of Proto-typing

Semiconductor chips and DRAM, we have been using various substrates such as ceramics, organic, and film to realize the damage-free process of low-temperature low-load, depending on the mounting form of sensors and modules. Please rely on our experienced Connectec Japan.