OSRDA

Research and Development

Entrusted development corresponding to various kinds of semiconductor assembly is possible.

Our major assembly machines are wafer dicer, printing machine, flip-chip bonder. We also have equipment for quality control such as X-ray spectrometer, secondary electron microscope with EDAX, heat-cycling tester and so on. In addition, we can respond your any request in cooperation with our partner companies.

Stud Bump Bonding

Facility

• Sud Bump Bonder

Printing

Facility

• Stencil Printing Machine

Dicing

Facility

• Blade Dicer

Dispensing

Facility

• Dispenser

Flip Chip Bonding

Facility

• Desk Top Flip chip bonder

Facility

• Manual Flip Chip Bonder

Facility

• High speed Flip Chip Bonder

Facility

• Full Automatic Flip Chip Bonder

Facility

• Semi Automatic Flip Chip Bonder

Facility

• Ultrasonic Flip Chip Bonder

Reflow・Bake・Oven

Facility

• N2 Reflow Oven

Facility

• Cure Oven

Evaluation・Analysis

Facility

• SEM/EDX

Facility

• X-ray Inspection System

Facility

• IR Microscope

Facility

• High Speed Camera

Facility

• Shear Tester

Facility

• Leaser Measuring System

Facility

• Laser Measuring System

Facility

• Automatic Grinder

Facility

• HT/THB Oven

Facility

• Thermal Cycle Oven