Research and Development | Semiconductor and Electronic Device Development, Manufacturing, and Material Evaluation - Connectec Japan

Research and Development

Entrusted development corresponding to various kinds of semiconductor assembly is possible.

Our major assembly machines are wafer dicer, printing machine, flip-chip bonder. We also have equipment for quality control such as X-ray spectrometer, secondary electron microscope with EDAX, heat-cycling tester and so on. In addition, we can respond your any request in cooperation with our partner companies.

Dicing

Facility: Wafer Dicer

Substrate dicer

Facility: Substrate dicer

Wafer Mounter

Facility: Wafer Mounter

UV Irradiator for Dicing Process

Facility: UV Irradiator for Dicing Process

Chip Sorting

Wafer Expander

Facility: Wafer Expander

Chip Sorter

Facility: Chip Sorter

Wire & Stud Bump Bonding

Wire & Stud Bump Bonder

Facility: Wire & Stud Bump Bonder

Printing

Printer

Facility: Printer

DTF Printer

Facility: DTF Printer

Dispensing

Dispenser

Facility: Dispenser

Flip Chip Bonding

Flip Chip Bonder ( Manual Alignment )

Facility: Flip Chip Bonder ( Manual Alignment )

Flip Chip Bonder ( Automatic Alignment )

Facility: Flip Chip Bonder ( Automatic Alignment )

Ultrasonic Flip Chip Bonder ( Manual Alignment )

Facility: Ultrasonic Flip Chip Bonder ( Manual Alignment )

Ultrasonic Flip Chip Bonder ( Automatic Alignment )

Facility: Ultrasonic Flip Chip Bonder ( Automatic Alignment )

DTF Flip Chip Bonder ( Automatic Alignment )

Facility: DTF Flip Chip Bonder ( Automatic Alignment )

Reflow & Cure

N2 Reflow Oven

Facility: N2 Reflow Oven

Formic Acid Reflow System

Facility: Formic Acid Reflow System

Clean Oven

Facility: Clean Oven

Pressurization Clean Oven

Facility: Pressurization Clean Oven

Resin Molding

Sheet Molding Machine

Facility: Sheet Molding Machine

SMD Chip Mounting

SMD Chip Mounter

Facility: SMD Chip Mounter

Marking

Laser Marker

Facility: Laser Marker

Reworking

Reworking Machine

Facility: Reworking Machine

Evaluating & Analyzing

Micro Manipulator

Facility: Micro Manipulator

Depth Synthetic Microscope

Facility: Depth Synthetic Microscope

Shear Strength Meter, IR Microscope, Measurement Microscope

Facility

Shear Strength Meter
IR Microscope
Measurement Microscope

Laser Displacement Meter

Facility: Laser Displacement Meter

Facility: Scanning Electron Microscope（SEM）

Scanning Acoustic Tomograph（SAT）

Facility: Scanning Acoustic Tomograph（SAT）

Ion Milling Machine

Facility: Ion Milling Machine

Automatic Polishing Machine

Facility: Automatic Polishing Machine

Manual Polishing Machine

Facility: Manual Polishing Machine

Pression Cutting Machine

Facility: Pression Cutting Machine

Diamond Wire Saw

Facility: Diamond Wire Saw

X-ray Inspection Machine

Facility: X-ray Inspection Machine

DC Test System

Facility: DC Test System

Manual Probing System

Facility: Manual Probing System

High Speed Camera

Facility: High Speed Camera

Thermal Cycle Test Chamber

Facility: Thermal Cycle Test Chamber

High Temperature Test Chamber, High Temperature Humidity Test Chamber

Facility

High Temperature Test Chamber
High Temperature Humidity Test Chamber

Plasma Cleaner

Facility: Plasma Cleaner

Flux Cleaning Machine

Facility: Flux Cleaning Machine

Binding machine , Label printer & Vacuum lamination machine

Facility: Binding machine , Label printer & Vacuum lamination machine

Draft Chamber

Facility: Draft Chamber