OSRDA
OSRDA
Research and Development
Entrusted development corresponding to various kinds of semiconductor assembly is possible.
Our major assembly machines are wafer dicer, printing machine, flip-chip bonder. We also have equipment for quality control such as X-ray spectrometer, secondary electron microscope with EDAX, heat-cycling tester and so on. In addition, we can respond your any request in cooperation with our partner companies.
Stud Bump Bonding

- Facility
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- Sud Bump Bonder
Printing

- Facility
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- Stencil Printing Machine
Dicing

- Facility
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- Blade Dicer
Dispensing

- Facility
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- Dispenser
Flip Chip Bonding

- Facility
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- Desk Top Flip chip bonder

- Facility
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- Manual Flip Chip Bonder

- Facility
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- High speed Flip Chip Bonder

- Facility
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- Full Automatic Flip Chip Bonder

- Facility
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- Semi Automatic Flip Chip Bonder

- Facility
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- Ultrasonic Flip Chip Bonder
Reflow・Bake・Oven

- Facility
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- N2 Reflow Oven

- Facility
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- Cure Oven
Evaluation・Analysis

- Facility
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- SEM/EDX

- Facility
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- X-ray Inspection System

- Facility
-
- IR Microscope

- Facility
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- High Speed Camera

- Facility
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- Shear Tester

- Facility
-
- Leaser Measuring System

- Facility
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- Laser Measuring System

- Facility
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- Automatic Grinder

- Facility
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- HT/THB Oven

- Facility
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- Thermal Cycle Oven