Exhibited at Semicon Japan 2019
This exhibition focused on the “Overview of the technology of narrow pitch wiring and bump simultaneous formation” of 10 .mu.m, and many customers were interested in the lectures by our CEO Hirata and CMO Ando.It was a good exhibition that will lead to 2020.
Thank you very much for coming.
Date: Wednesday, December 11 – Friday, December 13
Venue: Tokyo International Exhibition Center
Booth: West Exhibition Building, West Hall 1 3056
Official website ：https://www.semiconjapan.org/jp/