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It was published in the Ministry of Economy, Trade and Industry’s “100 startups with a track record of cooperation with the government (industry and business)”.

About us

We devote ourselves into '
creating
new technology' and contribute to
bright evoluation of mankind.

We, CONNECTEC JAPAN love our country and world peace, and wish to contribute to future of world manufacturing through development of semiconductor and electronics components and production technology. We believe that 'feeling joy for work' is fundamental virtue of human being and 'day-to-day work' is our real joy for life. CONNECTEC JAPAN firmly committed to continue to create 'joys for work' and share the joy with many friends in the world. CONNECTEC JAPAN shall keep improving day by day and 'creating new technology' for bright future of mankind.

Electronic product development
semiconductor

SERVICE

User Centric Design

We will totally support your requests from assembling semiconductor chips, MEMS chips, surface mounting, module proto-typing, evaluation/analysis, reliability test, mass-production. We will also respond to request from clients in cooperation with our partner companies.

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employees

OSRDA

According to the requirement from the clients,we will provide our proposal on concrete structure,design,proto-typing,and mass-production.

Development and Support

CASE

Low load damage-free assembly.
We are confident to be sure to meet your expectation.

Development Example

140℃ heat-resistant magnetic sensor for battery inspection High density bonding

A 140℃ heat-resistant magnetic sensor is high-density bonded to realize a two-dimensional magnetic sensor array.

COF board mounting for bonding MEMS sensors

To the FPC substrate sensor unit is opened, the MEMS sensor chip of length 40mm is implemented as a flip chip bonding.
connectec japn

Ceramic substrate bonding for inner ear hearing aids

A medical cochlear implant ASIC is mounted on a ceramic substrate with a flip chip bonding.

High-precision bonding of VCSEL chip FPC board

The VCSEL chip is bonded on the FPC board.
Development Example
building

Company

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News

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All Information Media Event
We will exhibit at Smart Sensing 2023 (May 31st to June 2nd)

We will exhibit at Smart Sensing 2023 (May 31st to June 2nd)
It was published in the Ministry of Economy, Trade and Industry’s “100 startups with a track record of cooperation with the government (industry and business)”.

It was published in the Ministry of Economy, Trade and Industry’s “100 startups with a track record of cooperation with the government (industry and business)”.
connectec japan

Our efforts were introduced in Niigata Nippo
Published in “Debut! web2023”, a local information magazine for students!

Published in “Debut! web2023”, a local information magazine for students!
We will exhibit at Nepcon Japan 2023 (January 25-27)
event

We will exhibit at Nepcon Japan 2023 (January 25-27)
connectec japan
event

Our CEO Katsunori Hirata took the podium at the Toyama Prefecture Growth Strategy Conference “Happy Toyama” panel discussion.
connectec japan
event

We exhibited at Smart Sensing 2022. (June 15-17, 2022)
Notification of joining the Japan Business Federation (Keidanren)
information

Notification of joining the Japan Business Federation (Keidanren)
Articles published in Forbes and Bloomberg.
information

Articles published in Forbes and Bloomberg.
ICC Summit FUKUOKA 2018 Session 10DArticle Published
information

ICC Summit FUKUOKA 2018 Session 10DArticle Published
Published in Japan Finance Corporation PR magazine “Link to the Japan Corporation”
media

Published in Japan Finance Corporation PR magazine “Link to the Japan Corporation”
It was published in “pro-wise” of the Hitachi Solutions member magazine
media

It was published in “pro-wise” of the Hitachi Solutions member magazine
We will exhibit at Nepcon Japan 2023 (January 25-27)
event

We will exhibit at Nepcon Japan 2023 (January 25-27)
connectec japan
event

Our CEO Katsunori Hirata took the podium at the Toyama Prefecture Growth Strategy Conference “Happy Toyama” panel discussion.
connectec japan
event

We exhibited at Smart Sensing 2022. (June 15-17, 2022)
We will exhibit at Smart Sensing 2022 (June 15-17, 2022)
event

We will exhibit at Smart Sensing 2022 (June 15-17, 2022)

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employees employee

CONNECTEC Japan is
currently recruiting personnel
due to business operation expansion.

Career