Dev. Ex.
140℃ heat-resistant magnetic sensor for battery inspection High density bonding
A 140℃ heat-resistant magnetic sensor is high-density bonded to realize a two-dimensional magnetic sensor array.
specification
| Special Stipulations | MONSTER PAC® 120°C low temperature bonding |
Conventional method 1
Mounting by wire bonding method ▼ Cannot be implemented in close proximity to the wire direction As a magnetic sensor, it becomes a one-dimensional sensor ▼ The sensor side or the inspected side (battery) need to move and scan ▼ Inefficiency
Conventional method 2
Flip chip bonding by solder
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Heat-resistant temperature of magnetic sensor chip is 140℃
Solder reflow temperature is 260℃
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Sensor characteristics deteriorate
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Not implementable
MONSTER PAC® Method
Low-temperature and low-load MONSTER PAC®️ 120℃ bonding
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Because there is no wire, it can be implemented in two dimensions
Because the bonding temperature is 120℃, no deterioration of the magnetic sensor chip
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Full bulk inspection is possible without the characteristic deterioration
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High efficiency
※In this case, delivery in five weeks from the first meeting to the customer exhibition