JISSO Cases

Evaluate materials based on the structure and conditions specified by the customer

Obtain various properties under structures and conditions tailored to the customer's intended application

Capability to develop equipment, including process development

Design and develop equipment from the perspective of the materials used and process development

Develop a system for collecting data from sensors that the customer wishes to evaluate

Support evaluation of sensor characteristics developed by the customer (This allows the customer to focus on sensor development!)

Implement security shields in post-processing

Prevent reverse engineering of programs and algorithms contained in the FPGA

High-precision bonding of VCSEL chips on FPC substrates

Bonding VCSEL chips onto FPC substrates

High-density bonding of 140°C heat-resistant magnetic sensors for battery inspection

140°C heat-resistant magnetic sensors are high-density bonded to form a two-dimensional magnetic sensor array.

COF board bonding of MEMS sensors

Flip-chip bonding of a 40mm-long MEMS sensor chip to an FPC substrate with an open sensor area.

Ceramic substrate bonding for in-ear hearing aids

Flip-chip bonding of the medical-grade cochlear implant ASIC onto a ceramic substrate.

Bonding of heat-sensitive LSI chips

Bonding a heat-sensitive LSI chip to a substrate.

Narrow-gap bonding of large-area sensors

Four 12mm□ LSI chips are bonded with a 30μm gap to realize a sensor array.

High Yield CoC of DRAM and CPU

The DRAM is bonded to the CPU and then bonded to the board.

Contract Development for All Processes

From PCB design to manufacturing, bonding, and further waterproofing.