JISSO Cases
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Evaluate materials based on the structure and conditions specified by the customer
Obtain various properties under structures and conditions tailored to the customer's intended application
- High Frequency
- Material Evaluation
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Capability to develop equipment, including process development
Design and develop equipment from the perspective of the materials used and process development
- Equipment Development
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Develop a system for collecting data from sensors that the customer wishes to evaluate
Support evaluation of sensor characteristics developed by the customer (This allows the customer to focus on sensor development!)
- Circuit design
- Embedded software development
- PC application development
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Implement security shields in post-processing
Prevent reverse engineering of programs and algorithms contained in the FPGA
- MONSTER PAC
- Security Shield
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High-precision bonding of VCSEL chips on FPC substrates
Bonding VCSEL chips onto FPC substrates
- MONSTER PAC
- Photonics-Electronics Co-Packaging
- Ultrasonic bonding
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High-density bonding of 140°C heat-resistant magnetic sensors for battery inspection
140°C heat-resistant magnetic sensors are high-density bonded to form a two-dimensional magnetic sensor array.
- Low temperature bonding
- MONSTER PAC
- Substrate Fabrication
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COF board bonding of MEMS sensors
Flip-chip bonding of a 40mm-long MEMS sensor chip to an FPC substrate with an open sensor area.
- Low temperature bonding
- MONSTER PAC
- Substrate Fabrication
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Ceramic substrate bonding for in-ear hearing aids
Flip-chip bonding of the medical-grade cochlear implant ASIC onto a ceramic substrate.
- Low temperature bonding
- MONSTER PAC
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Bonding of heat-sensitive LSI chips
Bonding a heat-sensitive LSI chip to a substrate.
- Low temperature bonding
- Medical
- MONSTER PAC
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Narrow-gap bonding of large-area sensors
Four 12mm□ LSI chips are bonded with a 30μm gap to realize a sensor array.
- Low temperature bonding
- Medical
- MONSTER PAC
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High Yield CoC of DRAM and CPU
The DRAM is bonded to the CPU and then bonded to the board.
- Low temperature bonding
- MONSTER PAC
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Contract Development for All Processes
From PCB design to manufacturing, bonding, and further waterproofing.
- MONSTER PAC