Dev. Ex.
Ceramic substrate bonding for inner ear hearing aids
A medical cochlear implant ASIC is mounted on a ceramic substrate with a flip chip bonding.
specification
| Special Stipulations | High reliability/MONSTER PAC® 170℃ low temperature bonding |
Conventional method
Flip chip bonding of LSI chip on board ▼ Bonding on cochlear implant board increase to solder melting temperature (260℃) ▼ LSI chip side solder remelt Open/short defect ▼ Low yield / Poor quality
MONSTER PAC® Method
Low-temperature and low-load MONSTER PAC®️ 170℃ bonding
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For mounting by conductive paste and NCP, raised to solder melting temperature (260℃) does not remelt
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No bonding defects, no open / short defects
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High yield, high quality
※High reliability package for medical devices