Dev. Ex.
High Voltage Evaluation TEG
Peripheral TEG Chip + Cera Board Flip Chip Bonding
specification
| Special Stipulations | Multi-pin area array MONSTER PAC® 170℃ low temperature bonding |
Peripheral TEG Chip + Cera Board Flip Chip Bonding
| Special Stipulations | Multi-pin area array MONSTER PAC® 170℃ low temperature bonding |