CONNECTEC JAPAN
日本語
中文（繁体）
English
한국어
日本語
中文（繁体）
English
한국어
CONTACT
News
Service
Contract development
Dev. Ex.
Contract development
Contract development
Development and Support
Trial Process Menu
Research and Development
MONSTER PAC® Core Technology
FSNIP
DTF for Industry 4.0
Company
Company
Company
History
Philosophy
Guidelines
Quality policy・Environmental policy
Location
Career
CONTACT
Privacypolicy
Dev. Ex.
Solder FCBGA prototype
Flip chip bonding of solder bumped chip
specification
Special Stipulations
Pulse heat local reflow mounting
View All
ホーム
開発事例
Solder FCBGA prototype