Dev. Ex.

Narrow gap bonding of large area sensors

Four 12mm□ LSI chips are implemented with a gap of 30um to achieve a set sensor.

specification

Special Stipulations MONSTER PAC® 170°C low temperature bonding

Conventional method 1

Bonding by ACF bonding   ▼ (1) High load required of 100kgf or more due to large area (2) ACF bonding requires a gap of 300μm or more   ▼ Not feasible

Conventional method 2

Flip chip bonding by solder
  ▼
Solder melting temperature is 260℃
Film substrate (FPC) is deformed by heat
  ▼
Not feasible

Conventional method 2

MONSTER PAC® Method

MONSTER PAC®️ Method

Low temperature and low load MONSTER PAC® 170℃ bonding
  ▼
Bonding temperature 170℃ bonding by conductive paste and NCP
No deformation of the film substrate
Large area LSI chips can be bonded at low load
  ▼
feasible