Dev. Ex.
Narrow gap bonding of large area sensors
Four 12mm□ LSI chips are implemented with a gap of 30um to achieve a set sensor.
specification
| Special Stipulations | MONSTER PAC® 170°C low temperature bonding |
Conventional method 1
Bonding by ACF bonding
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(1) High load required of 100kgf or more due to large area
(2) ACF bonding requires a gap of 300μm or more
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Not feasible
Conventional method 2
Flip chip bonding by solder
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Solder melting temperature is 260℃
Film substrate (FPC) is deformed by heat
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Not feasible
MONSTER PAC® Method
Low temperature and low load MONSTER PAC® 170℃ bonding
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Bonding temperature 170℃ bonding by conductive paste and NCP
No deformation of the film substrate
Large area LSI chips can be bonded at low load
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feasible