Dev. Ex.
High-precision bonding of VCSEL chip FPC board
The VCSEL chip is bonded on the FPC board.
![]( https://www.connectec-japan.com/wordpress/wp-content/uploads/2023/05/4adcf3adcd6a51c59f0e6456fe3186f1.png)
specification
Special Stipulations | MONSTER PAC® 80℃ low temperature bonding |
Conventional method
Bonding VCSEL chip on FPC board ▼ Due to solder melting temperature is at high temperature (260℃) FPC thermally expand After bonding, it return to room temperature and FPC shrink ▼ Optical axis deviation with optical fiber occurs (>3μm) ▼ Reflection and attenuation occur ※VCSEL (pixel) : Vertical Cavity Surface Emitting LASER Vertical resonator surface light emitting laser
![Conventional method](https://www.connectec-japan.com/wordpress/wp-content/uploads/2023/05/4_img01.jpg)
MONSTER PAC® Method
![MONSTER PAC®️ Method](https://www.connectec-japan.com/wordpress/wp-content/uploads/2023/05/4_img04.jpg)
Low-temperature and low-load MONSTER PAC®️ 80℃ bonding
▼
For the mounting of the bonding temperature 80℃ by conductive paste and NCP, FPC doesn't expand
▼
Optical axis deviation with optical fiber does not occur (>3μm)
▼
No reflection or attenuation