Dev. Ex.
High-precision bonding of VCSEL chip FPC board
The VCSEL chip is bonded on the FPC board.
specification
| Special Stipulations | MONSTER PAC® 80℃ low temperature bonding |
Conventional method
Bonding VCSEL chip on FPC board
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Due to solder melting temperature is at high temperature (260℃) FPC thermally expand
After bonding, it return to room temperature and FPC shrink
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Optical axis deviation with optical fiber occurs (>3μm)
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Reflection and attenuation occur
※VCSEL (pixel) : Vertical Cavity Surface Emitting LASER
Vertical resonator surface light emitting laser
MONSTER PAC® Method
Low-temperature and low-load MONSTER PAC®️ 80℃ bonding
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For the mounting of the bonding temperature 80℃ by conductive paste and NCP, FPC doesn't expand
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Optical axis deviation with optical fiber does not occur (>3μm)
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No reflection or attenuation