Dev. Ex.
Bonding of thermally vulnerable LSI chip
Bond an LSI chip that is sensitive to heat to the substrate.
specification
| Special Stipulations | MONSTER PAC® 80°C low temperature bonding |
Conventional method
Bonding heat-vulnerable LSI chips on board
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(1) Solder melting temperature is at high temperature (260℃) LSI chips deteriorates due to heat
(2) Of parts that have already been implemented There is a gap, a fallout
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Not feasible
MONSTER PAC® Method
Low-temperature and low-load MONSTER PAC®️ 80℃
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(1) For 80℃ mounting by conductive paste and NCP, thermally vulnerable LSI chips do not deteriorate
(2) Since the solder melting temperature is not 260℃, of parts that have already been solder bonding no deviation, no falling off
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feasible