Dev. Ex.
Bonding of thermally vulnerable LSI chip
Bond an LSI chip that is sensitive to heat to the substrate.
specification
| Special Stipulations | MONSTER PAC® 80°C low temperature bonding |
Conventional method
Bonding heat-vulnerable LSI chips on board ▼ (1) Solder melting temperature is at high temperature (260℃) LSI chips deteriorates due to heat (2) Of parts that have already been implemented There is a gap, a fallout ▼ Not feasible
MONSTER PAC® Method
Low-temperature and low-load MONSTER PAC®️ 80℃
▼
(1) For 80℃ mounting by conductive paste and NCP, thermally vulnerable LSI chips do not deteriorate
(2) Since the solder melting temperature is not 260℃, of parts that have already been solder bonding no deviation, no falling off
▼
feasible