Dev. Ex.

Bonding of thermally vulnerable LSI chip

Bond an LSI chip that is sensitive to heat to the substrate.

specification

Special Stipulations MONSTER PAC® 80°C low temperature bonding

Conventional method

Bonding heat-vulnerable LSI chips on board  ▼ (1) Solder melting temperature is at high temperature (260℃) LSI chips deteriorates due to heat (2) Of parts that have already been implemented There is a gap, a fallout  ▼ Not feasible

Conventional method

MONSTER PAC® Method

MONSTER PAC®️ Method

Low-temperature and low-load MONSTER PAC®️ 80℃
 ▼
(1) For 80℃ mounting by conductive paste and NCP, thermally vulnerable LSI chips do not deteriorate
(2) Since the solder melting temperature is not 260℃, of parts that have already been solder bonding no deviation, no falling off
 ▼
feasible