Dev. Ex.

COF board mounting for bonding MEMS sensors

To the FPC substrate sensor unit is opened, the MEMS sensor chip of length 40mm is implemented as a flip chip bonding.

specification

Special Stipulations MONSTER PAC® low temperature bonding

Conventional method 1

wire bonding   ▼ (1) When FPC folding of the housing built-in, the wire breaks (2) When pressing against the human body and using it, etc. When pressure is applied, the wire collapses and disconnections   ▼ Not implementable

Conventional method 2

Flip chip bonding by solder
  ▼
After solder reflow (260℃) cooling, the substructure shrinks largely
  ▼
Warping of joints, non-bonded due to deformed large
  ▼
Solder not possible

Conventional method 2

MONSTER PAC® Method

MONSTER PAC®️ Method

Low-temperature and low-load MONSTER PAC®️ 170℃ bonding
  ▼
Because there is no wire
(1) No disconnection when housing is built
(2) No collapse or disconnection when pushing the human body
  ▼
feasible