Dev. Ex.
COF board mounting for bonding MEMS sensors
To the FPC substrate sensor unit is opened, the MEMS sensor chip of length 40mm is implemented as a flip chip bonding.
specification
| Special Stipulations | MONSTER PAC® low temperature bonding |
Conventional method 1
wire bonding
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(1) When FPC folding of the housing built-in, the wire breaks
(2) When pressing against the human body and using it, etc. When pressure is applied, the wire collapses and disconnections
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Not implementable
Conventional method 2
Flip chip bonding by solder
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After solder reflow (260℃) cooling, the substructure shrinks largely
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Warping of joints, non-bonded due to deformed large
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Solder not possible
MONSTER PAC® Method
Low-temperature and low-load MONSTER PAC®️ 170℃ bonding
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Because there is no wire
(1) No disconnection when housing is built
(2) No collapse or disconnection when pushing the human body
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feasible