Dev. Ex.
Automotive Reliability Evaluation TEG
Area Array TEG Chip + Organic Board Flip Chip Bonding
specification
Special Stipulations | Multi-pin area array MONSTER PAC® 170℃ low temperature bonding |
Area Array TEG Chip + Organic Board Flip Chip Bonding
Special Stipulations | Multi-pin area array MONSTER PAC® 170℃ low temperature bonding |