News

We made a technical presentation at ICEP2024 (23rd International Conference on Electronics Packaging), an international conference on semiconductor packaging, held at the Toyama International Conference Center from April 17th to April 19th.

During the conference, a wide range of cutting-edge research and development projects related to advanced packaging were presented, and Komatsu from our Advanced Development Department gave a poster presentation on the latest efforts in fine bump formation and fine wiring transfer to stepped areas regarding FSNIP, a fine wiring bump formation technology using a transfer process.

Please refer to this link for the contents of the presentation.

<Link to poster contents>

https://acrobat.adobe.com/id/urn:aaid:sc:AP:21472fa0-2ef2-405c-acb0-a421b719a918