News

Our company will be held at Tokyo Big Sight from Wednesday, January 25th to Friday, January 27th, 2023
“Semiconductor and Sensor Packaging Technology Exhibition” in “Nepcon Japan”
We will exhibit under the theme of “Revolution in IoT implementation with the power to change and connect” (booth number: 24-26).

This exhibition brings together packaging technologies such as manufacturing and assembly equipment for semiconductors and sensors, packaging materials, and plating technologies.

Semiconductor/Sensor Packaging Technology Exhibition URL
https://www.nepconjapan.jp/tokyo/ja-jp/about/isp.html

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As the IoT society progresses, the development and manufacturing of electronic devices are also being forced to undergo major changes.
Electronic devices for IoT are equipped with sensors on all kinds of things, and because of the characteristics of high-speed data communication,
The number of products using non-conventional structures and materials and products for non-conventional applications is rapidly increasing.

For this reason, in addition to semiconductor and electronic device manufacturers, which have traditionally been the main players in the development and manufacturing of electronic devices for IoT,
Opportunities to enter the market are emerging from the material industry, which is closer to the source, and conversely, from the service industry, which is closer to the consumer.

However, since electronic devices for IoT have a wide variety of structures, materials, construction methods, and quantities,
Traditional semiconductor contract manufacturing business (OSAT: Outsourced Semiconductor Assembly & Test) specializing in small-variety mass production
The number of cases that cannot be dealt with is increasing.
For this reason, we have developed products that correspond to the wide variety of electronic devices for IoT, and have responded to high-mix variable-volume production
Building a business model is required.

Our company is a one-stop business that undertakes everything from mounting development to manufacturing of a wide variety of electronic devices for IoT.
(OSRDA: Outsourced Semiconductor R&D Assembly).
In the OSRDA business, if it is related to mounting such as semiconductors, MEMS, sensors, etc., please write a memo about your request.
We will listen to you from the idea level, examine and propose specific structures, construction methods, and materials.

At that time, 80 ℃ low temperature mounting (MONSTER PAC®) using conductive paste, which is our core technology,
In addition to utilizing technologies such as stud bumps, ultrasonic mounting, and solder mounting, we also use construction methods that we do not possess,
Regarding equipment and materials, we will connect companies with excellent technology all over Japan,
We will do our best to meet your needs. In addition, the OSRDA business does not have entry and exit restrictions.
We will respond to anything related to mounting, from construction method development to equipment development, one prototype, and mass production.

At this exhibition, in addition to introducing the OSRDA business, we have a large number of consignment development examples in our booth.
We hope that your visit will help us understand the innovative implementation development projects that you are working on and considering every day.
I would be very happy if I could contribute to further development.

We look forward to seeing you there.

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■ Date and time
January 25 (Wednesday) to January 27 (Friday), 2023
10:00-17:00

■ Venue
Tokyo Big Sight East Exhibition Hall East 3 Hall (Our booth location: 24-26)
*For details, please check the map below.

■ Visitor registration method
Pre-registration is required for this exhibition.
Please download the invitation ticket from the link on the URL below.

https://www.nepconjapan.jp/tokyo/ja-jp/visit/e-ticket-ex/isp.html?co=ISP1-0579

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■ Seminar information

Representative Director and CEO Hirata will give a special lecture on the following content.

Speaker: Katsunori Hirata
Date and time: Thursday, January 26, 10:00-11:10
Lecture title: Revolutionizing IoT implementation with “power to change” and “power to connect”

The venue for the special lecture will be confirmed around mid-January.

To attend the seminar, you need to register for the seminar from the URL below.

https://reed-speaker.jp/Seminar/2023/inwtokyo/top/?id=NEPCON

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