We participated IMAPS
15th International sponsored by The International Microelectronics Assembly and Packaging Society iMAPS (International Microelectronics Assembly) on Semiconductor Packaging Presented at the Technical Session of the Conference and Exhibition on DEVICE PACKAGING. Approximately 600 visitors from 15 countries visited the event, mainly in microelectronics system installation and packaging technologies. Technical sessions are held in three parallel sessions, such as microelectronics, interposers, 3D ICs and their packaging, FOWLP, flip-chip, State-of-the-art technology presentations were held and lively discussions were held in each session of microsystems and device engineering (including MEMS and sensors) and the new automotive packaging sessions.
Date: March 4 – March 7, 2019
Location: Arizona, Fountain Hills, Wekopa Resort