Presented at IMPACT-IAAC 2019
At THE IMPACT-IAAC 2019 held in Taipei, CONNECTEC Japan
We made presentation.
This society is the largest society in Taiwan where experts in packaging and PCB meet together.
This time, ICFPE2019, a flexible and printed electronics society in major Asian countries, was held in Taiwan, and these two academic societies were held jointly.
CONNECTEC Japan has presented the contents of the low-temperature flip-chip bonding technology for 10μm narrow pitch wiring and bump simultaneous formation.
The session venue with a capacity of 100 people was full at the time of the presentation, and there were voices that attracted attention from the Semicon Taiwan exhibition, so we felt the high level of attention for this technology.
Date: Wednesday, October 23 – Friday, October 25
Venue: Taipei Nangang Exhibition Center, TAIWAN