News

16th International hosted by IMAPS (International Microelectronics Assembly and Packaging Society) of the Semiconductor Packaging Society The technical presentation of MONSTER PAC 10um was held at the Technical Session of Conference and Exhibition on DEVICE PACKAGING.
Yuji Komatsu, Director of the Advanced Development Division, explained the novel construction method and example 10um pitch wiring of the same shape as the master by intaglio replica, and attracted a great deal of attention.
It is a compact process to solve problems such as transmission speed, signal delay, signal purity, and large-scale investment, which have reached the technical limits of IoT/5G semiconductors in the future, and I felt a strong response with the interest of so many listeners.
We will continue to accelerate development and promote development in the future.

Dates: March 2- 5, 2020
Location: Arizona, Fountain Hills, And Wecopa Resort, USA