An article was published in Semicon Portal

On February 3, 2023, at the Semicon Portal, “Advanced Package

Connectec that promotes low-temperature mounting of 3D-IC packaging in

Our OSRDA business model, MonsterPAC &

An article on the chiplet market initiatives by FSNIP etc. is posted

it was done.

You can read the article on the following Semicon Portal HP,

Please take a look.