An article was published in Semicon Portal
On February 3, 2023, at the Semicon Portal, “Advanced Package
Connectec that promotes low-temperature mounting of 3D-IC packaging in
Our OSRDA business model, MonsterPAC &
An article on the chiplet market initiatives by FSNIP etc. is posted
it was done.
You can read the article on the following Semicon Portal HP,
Please take a look.