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NextFlex is American consortium for developing Flexible Hybrid Electronics (FHE)
Our ‘one and only’ technology ‘Low temperature/Low load damage free bonding system We call our business style as 『OSRDA』。
6th Sept. 2017 ICC Event 【Realtech catapult】 「Best Presenter」! awarded
NextFlex Lunchon Seminar
Semicon WEST 2017
Semicon China 2017
TECH PLANTER Meetup
Tokyo Institute of Technology
19th January, 2017 at Fujikin ‘Medical Equipment , AI, and IoT’ Seminar
