News

CONNECTEC Japan will exhibit at SEMICON JAPAN 2023/APCS which will be held at Tokyo Big Sight from Wednesday, December 13th to Friday, December 15th, 2023.

This year as well, we will be exhibiting at the APCS (Advanced Packaging and Chiplet Summit), one of the largest events for semiconductor packaging and assembly technology co-located with SEMICON JAPAN 2023.

 

<Overview>

This year’s APCS theme is “A New Era and the Direction of Evolution in the Semiconductor Packaging Industry.” Last year, trends in the world of semiconductor packaging using chiplets were introduced at APCS, and many people who were highly interested in the arrival of a new era attended. This year’s APCS2023 will be a place to introduce and discuss how manufacturers and users are evolving in this new era. In accordance with this year’s APCS theme, CONNECTEC JAPAN will exhibit many prototyping examples which was developed in contract with our OSRDA business model.

 

■Chiplet bonding /2.xD bonding /3D bonding entrusted development example In response to various requests such as chiplet packaging for heterogeneous processes that cannot be realized with SoC, we will propose optimal structures, processes, and materials, such as adjacent bonding within 30μ between chips, to realize your requests.

■Photonics-Electronics-Conversion assembly technology entrusted development example For high-speed broadband signal transmission, optical communication between systems, between modules, and within modules is progressing. Please take a look at examples of entrusted development at the venue for the implementation of optical-electrical converters that bridge telecommunications and optical communications.

■Example of entrusted development for high-speed communication We also undertake module implementation for high-speed communication exceeding 100Gb/s. We also undertake high frequency loss, S parameter measurements, etc.

■High-speed communication entrusted development example We also undertake module implementation for high-speed communication exceeding 100Gb/s. We also undertake high frequency loss, S parameter measurements, etc.

We would be very happy if you could take a look at the latest development examples at our booth and contribute to your innovative implementation development. We are looking forward to seeing you at our booth.

 

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■Date and time
2023/12/13(Wed.)～12/15(Fri.) 10：00～17：00

■Venue
East hall 2 directly in front of the main stage

■How to register visitors This exhibition requires advance registration.
Please register your attendance from the link on the URL below.
https://www.semiconjapan.org/jp/about/pricing-and-register

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