News

Our company was held at Tokyo Big Sight from Wednesday, December 13th to Friday, December 15th, 2023.
Large-scale event for semiconductor packaging and mounting technology within “SEMICON Japan 2023”
We exhibited at “APCS (Advanced Packaging and Chiplet Summit)”.

We would like to express our sincere gratitude to the many people from Japan and abroad who visited our booth and discussed business with us.
We are working together as one to be able to respond to a wide variety of consultation cases in the future.
We look forward to your continued patronage as we move forward with our business.