News

Our event will be held at Tokyo Big Sight from Wednesday, January 24th to Friday, January 26th, 2024.
We will be exhibiting at the “Semiconductor Sensor Packaging Exhibition” within “Nepcon Japan 2024” this year as well.

<Summary>

At last year’s Nepcon Japan, global trends in semiconductor packaging using chiplets were attracting attention, and many people who were highly interested in the arrival of a new era visited the exhibition.
At CONNECTEC Japan, we will focus on exhibiting how the manufacturers and users are evolving in this new era, focusing on the following content.

■Chiplet mounting/2.xD mounting/3D mounting
In response to various requests such as chiplet packaging for disparate processes that cannot be realized with SoC, we will propose optimal structures, construction methods, and materials to realize customer requests.

■Optoelectronic fusion implementation
For high-speed broadband signal transmission, optical communication between devices, between modules, and within modules is progressing.
Please take a look at examples of commissioned development at the venue for the implementation of photoelectric conversion products that bridge telecommunications and optical communications.

■High-speed communication
We also undertake module implementation for high-speed communication exceeding 100Gb/s. We also undertake high frequency loss, S parameter measurements, etc.

■Various sensing device implementation
We will propose the optimal mounting method according to various sensor devices. It is also possible to tile sensor devices, which are particularly difficult to create over a large area, by laying them out with a minimum gap of 30 µm to increase the mounting area.

By visiting us, you will be able to learn more about the innovative implementation and development projects that you are working on and considering every day.
I would be very happy if I could contribute to further development.

We look forward to your visit.

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■Date and time
Wednesday, January 24, 2024 – Friday, January 26, 2024
10:00-17:00

■Venue
East 4 entrance/exit front

■Visitor registration method
This exhibition requires advance registration.
Please register your attendance from the link on the URL below.

Visitor registration
https://www.nepconjapan.jp/tokyo/ja-jp/register.html?code=0899646121985455-KV4

VIP registration (section manager or above)
https://www.nepconjapan.jp/tokyo/ja-jp/register.html?code=0899646122079034-FPY

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