2019-12

Investment from Mitsui Chemicals

2019-12

Received the Minister of Economy, Trade and Industry Award for the 8th Monozukuri Nippon Grand Prize “Manufacturing and Production Process Category

2018-06

Ministry of Economy, Trade and industry J-startup Program Selection
one of nationwide 97 Certified Companies

2018-04

Investment from Dai-ichi life insurance Company

2018-02

Investment from Mitsui&Company

2017-07

Opened an office in Akihabara, Tokyo

2017-07

Established a US base in NextFlex (NextFlex is a Flexible Hybrid Electronics (FHE) consortium sponsored by the United States government, which is designed to create greater innovation in the market)

2017-01

Investment from Niigata Venture Capital

2017-01

Investment from LeadinWay.

2017-01

Investment from Nidec Corporation

2016-11

Investment from Real Tech Fund

2016-09

Bonding Temperature120°c achieved

2016-07

Capital is increased to \525,266,700(JPY)

2015-12

Opened a sales branch in Silicon Valley in the United States.
(CONNECTEC AMERICA)

2015-10

Released DTF #1.

2015-08

The first DTF Flip Chip Bonder completed

2015-06

Business partnership with Fujikin Co., Ltd.

2014-12

Investment from Shinsei Bank

2014-12

Business alliance with MEMS Core, Inc.

2014-09

Bonding Temperature150°c achieved

2014-07

Investment from TNP On The Road Co.,Ltd. (Venture Capital)

2013-06

Relocation of CONNECTEC KOREA Office

2013-06

MSIVC2008V Investment Business Limited Partnership Mitsui Sumitomo Insurance Capital Corporation

2013-03

Agent agreement with Chinese Semiconductor company, Jcap and commence sales promotion of its WLCSP and RDL ,etc. in Japanese domestic market.

2012-11

Investment from KSP Co. Ltd. As KSP 3 Business Limited Partnership Unlimited partner

2012-09

Establish office in ITRI Open-Lab Taiwan to have close contact with Taiwan customers and accelerate technological development and production expansion in
* ITRI (Industrial Technology Research)

2012-08

Investment from NEC Capital Solutions Co., Ltd. And SMBC Venture Capital Co., Ltd. As Innovation Venture Investment limited for business. Unlimited Liability Union member.

2012-08

Investment from Mizuho Capital Co., LTD as 3rd Mizuho Capital limited Business Investment Union. Unlimited liability Union member.

2012-07

Certified as third “specific development plan” based on the Act on the Advancement of Manufacturing PCB technology for small and middle-sized enterprises in the Ministry of Economy, Trade and industry (Theme name: Ultra high density and damage-free bonding technology using soft bumps and development of next-generation semiconductor package

2012-06

Established CONNECTEC Corporation (Office in TAIWAN)

2012-06

Investment from Daishi Management Consulting Co., Ltd. (Venture Capital) as Daishi
Corporate incubation fund project.

2012-05

Investment from Neo Stella Capital Co., Ltd. (Venture Capital) as first Neo Stella investment project.

2012-03

NEDO(New Energy and Industrial Technology Development Organization) subsidy project for Practical development of industrial technology for year 2010～2012. Project completed on 2nd February of 2012 and received the subsidy (payment).

2012-03

Completed 2011 “New Foundation support subsidy” project of Niigata Industrial Creation organization on 29th February, 2011. Receive a grant (payment)

2012-01

Investment from Namics Co., Ltd.

2011-07

Signed license agreement with ChipMOS TECHNOLOGIES in Taiwan for joint development and comprehensive Business Alliance including investment

2011-04

Niigata Industrial Creation organization. Year 2012 newly established project support subsidy confirmed.

2011-03

Investment from SIP Co., Ltd. (Venture Capital) as digital convergence investments.

2011-03

Investment from Niigata Venture Capital Co., Ltd. (Venture Capital) as the first Niigata Incubation Fund Investment.

2011-03

Completed 2010 “New Foundation support subsidy” project of Niigata Industrial Creation organization on 28th February 2010. Receive a grant (payment)

2011-02

Completed development subsidy project of the national small and medium-sized Enterprises Association of Japan on 31st December, 2010 as planed. Receive a grant (payment)

2010-11

MonsterPAC TypeC Sample First shipment (to Korean DSP manufacturer)

2010-09

Bonding Temperature170°c achieved

2010-07

The national small and medium-sized business organization Central meeting “subsidy for development of products for small and medium Enterprises” grant decision and theme name: Development of fine pitch connection technology for display driver package

2010-07

NEDO Grant decision and theme name of “Innovation practical development cost subsidy”: Practical development of fine pitch high performance tape carrier package

2010-06

METI certified as a “specific development plan” based on the Act on the Advancement of Manufacturing Board technology for small and medium-sized enterprises. Theme Name: High performance and fine pitch COF of the package Development

2010-05

MonsterPAC Type F Sample First shipment (to Korean LCD driver manufacturer)

2010-05

Received the subsidy from Niigata Industrial Creation Organization, as support for new innovative founder.

2010-03

Opened offices in Korea and China.

2010-03

The “specific research and development plan” based on the Act on the Advancement of Manufacturing Board technology for small and middle-sized enterprises of the Ministry of Economy, Trade and industry: Development of high-performance semiconductor package using high-density mounting technology

2009-11

Established CONNECTEC JAPAN CORPORATION