History
- 2019-12
- Investment from Mitsui Chemicals
- 2019-12
- Received the Minister of Economy, Trade and Industry Award for the 8th Monozukuri Nippon Grand Prize “Manufacturing and Production Process Category
- 2018-06
- Ministry of Economy, Trade and industry J-startup Program Selection
one of nationwide 97 Certified Companies
- 2018-04
- Investment from Dai-ichi life insurance Company
- 2018-02
- Investment from Mitsui&Company
- 2017-07
- Opened an office in Akihabara, Tokyo
- 2017-07
- Established a US base in NextFlex (NextFlex is a Flexible Hybrid Electronics (FHE) consortium sponsored by the United States government, which is designed to create greater innovation in the market)
- 2017-01
- Investment from Niigata Venture Capital
- 2017-01
- Investment from LeadinWay.
- 2017-01
- Investment from Nidec Corporation
- 2016-11
- Investment from Real Tech Fund
- 2016-09
- Bonding Temperature120°c achieved
- 2016-07
- Capital is increased to \525,266,700(JPY)
- 2015-12
- Opened a sales branch in Silicon Valley in the United States.
(CONNECTEC AMERICA)
- 2015-10
- Released DTF #1.
- 2015-08
- The first DTF Flip Chip Bonder completed
- 2015-06
- Business partnership with Fujikin Co., Ltd.
- 2014-12
- Investment from Shinsei Bank
- 2014-12
- Business alliance with MEMS Core, Inc.
- 2014-09
- Bonding Temperature150°c achieved
- 2014-07
- Investment from TNP On The Road Co.,Ltd. (Venture Capital)
- 2013-06
- Relocation of CONNECTEC KOREA Office
- 2013-06
- MSIVC2008V Investment Business Limited Partnership Mitsui Sumitomo Insurance Capital Corporation
- 2013-03
- Agent agreement with Chinese Semiconductor company, Jcap and commence sales promotion of its WLCSP and RDL ,etc. in Japanese domestic market.
- 2012-11
- Investment from KSP Co. Ltd. As KSP 3 Business Limited Partnership Unlimited partner
- 2012-09
- Establish office in ITRI Open-Lab Taiwan to have close contact with Taiwan customers and accelerate technological development and production expansion in
* ITRI (Industrial Technology Research)
- 2012-08
- Investment from NEC Capital Solutions Co., Ltd. And SMBC Venture Capital Co., Ltd. As Innovation Venture Investment limited for business. Unlimited Liability Union member.
- 2012-08
- Investment from Mizuho Capital Co., LTD as 3rd Mizuho Capital limited Business Investment Union. Unlimited liability Union member.
- 2012-07
- Certified as third “specific development plan” based on the Act on the Advancement of Manufacturing PCB technology for small and middle-sized enterprises in the Ministry of Economy, Trade and industry (Theme name: Ultra high density and damage-free bonding technology using soft bumps and development of next-generation semiconductor package
- 2012-06
- Established CONNECTEC Corporation (Office in TAIWAN)
- 2012-06
- Investment from Daishi Management Consulting Co., Ltd. (Venture Capital) as Daishi
Corporate incubation fund project.
- 2012-05
- Investment from Neo Stella Capital Co., Ltd. (Venture Capital) as first Neo Stella investment project.
- 2012-03
- NEDO(New Energy and Industrial Technology Development Organization) subsidy project for Practical development of industrial technology for year 2010~2012. Project completed on 2nd February of 2012 and received the subsidy (payment).
- 2012-03
- Completed 2011 “New Foundation support subsidy” project of Niigata Industrial Creation organization on 29th February, 2011. Receive a grant (payment)
- 2012-01
- Investment from Namics Co., Ltd.
- 2011-07
- Signed license agreement with ChipMOS TECHNOLOGIES in Taiwan for joint development and comprehensive Business Alliance including investment
- 2011-04
- Niigata Industrial Creation organization. Year 2012 newly established project support subsidy confirmed.
- 2011-03
- Investment from SIP Co., Ltd. (Venture Capital) as digital convergence investments.
- 2011-03
- Investment from Niigata Venture Capital Co., Ltd. (Venture Capital) as the first Niigata Incubation Fund Investment.
- 2011-03
- Completed 2010 “New Foundation support subsidy” project of Niigata Industrial Creation organization on 28th February 2010. Receive a grant (payment)
- 2011-02
- Completed development subsidy project of the national small and medium-sized Enterprises Association of Japan on 31st December, 2010 as planed. Receive a grant (payment)
- 2010-11
- MonsterPAC TypeC Sample First shipment (to Korean DSP manufacturer)
- 2010-09
- Bonding Temperature170°c achieved
- 2010-07
- The national small and medium-sized business organization Central meeting “subsidy for development of products for small and medium Enterprises” grant decision and theme name: Development of fine pitch connection technology for display driver package
- 2010-07
- NEDO Grant decision and theme name of “Innovation practical development cost subsidy”: Practical development of fine pitch high performance tape carrier package
- 2010-06
- METI certified as a “specific development plan” based on the Act on the Advancement of Manufacturing Board technology for small and medium-sized enterprises. Theme Name: High performance and fine pitch COF of the package Development
- 2010-05
- MonsterPAC Type F Sample First shipment (to Korean LCD driver manufacturer)
- 2010-05
- Received the subsidy from Niigata Industrial Creation Organization, as support for new innovative founder.
- 2010-03
- Opened offices in Korea and China.
- 2010-03
- The “specific research and development plan” based on the Act on the Advancement of Manufacturing Board technology for small and middle-sized enterprises of the Ministry of Economy, Trade and industry: Development of high-performance semiconductor package using high-density mounting technology
- 2009-11
- Established CONNECTEC JAPAN CORPORATION