Company Overview

Acquired Happy Partner Company certification

Change of representative director and president

Number of projects exceeded 340 in 2023

Acquired ISO9001 & ISO14001 certification

Joined the Japan Business Federation (Keidanren)

Capital and business alliance with Valqua Co., Ltd.

Received the Ministry of Economy, Trade and Industry’s Small and Medium Enterprise Agency’s “300 Small and Medium Enterprises and Small Businesses” in the “Manufacturing and Productivity” category.

Strategic alliance with Mitsui Chemicals, Inc.

Received the Minister of Economy, Trade and Industry Award in the Manufacturing/Production Process Category at the 8th Monodzukuri Nippon Grand Awards

Certified as one of 97 companies nationwide selected for the Ministry of Economy, Trade and Industry’s “J-Startup Program”

Japan Venture Awards 2018 Small and Medium Enterprise Agency Commissioner Award

Capital alliance with Mitsui & Co., Ltd.

Opened base in Akihabara

Opened base in Next Flex, USA
(NextFlex is a Flexible Hybrid, which is a rapidly growing market.
A consortium sponsored by the U.S. government created for the purpose of creating even greater innovation in the field of electronics (FHE))

Opened a sales branch in Silicon Valley, USA (CONNECTEC AMERICA)

Business partnership with Fujikin Co., Ltd.

Business partnership with Mems Core Co., Ltd.

CONNECTEC KOREA office relocated

Signed an agent contract with jcap in China and started handling WLCSP, RDL, etc. in Japan.

Opened Taiwan office
A new office will be established at the Industrial Technology Research Institute of Taiwan (ITRI) Open-Lab in order to have close contact with Taiwanese companies and accelerate technology development and production expansion in Taiwan.
*ITRI(Industrial Technology Research Institute)

Certified as a “specific development plan” based on the Ministry of Economy, Trade and Industry’s Act on the Advancement of Manufacturing Board Technology for Small and Medium Enterprises (3rd case)
Theme name: Development of ultra-high-density, damage-free bonding technology and next-generation semiconductor packages using soft bumps

Established CONNECTEC Corporation (Taiwanese subsidiary)

The New Energy and Industrial Technology Development Organization (NEDO)’s “Industrial Technology Practical Development Cost Subsidy Project” from 2010 to 2012 was completed on February 29, 2012. Receive a grant (payment)

Signed a comprehensive business partnership agreement with ChipMOS TECHNOLOGIES in Taiwan, including licensing, joint development, and investment from our company.

Certified by the Ministry of Economy, Trade and Industry as a “Specific Development Plan” based on the Act on the Advancement of Manufacturing Board Technology for Small and Medium Enterprises
Theme name: Development of high performance/fine pitch COF package

Opened Korean office
China office opened

Certified as a “Specific Research and Development Plan” based on the Ministry of Economy, Trade and Industry’s Act on the Advancement of Manufacturing Board Technology for Small and Medium Enterprises
Theme name: Development of high-performance semiconductor packages using high-density packaging technology

Established Connectec Japan Co., Ltd.