Company

Investment from Mitsui Chemicals

Received the Minister of Economy, Trade and Industry Award for the 8th Monozukuri Nippon Grand Prize “Manufacturing and Production Process Category

Ministry of Economy, Trade and industry J-startup Program Selection one of nationwide 97 Certified Companies

Investment from Dai-ichi life insurance Company

Investment from Mitsui&Company

Opened an office in Akihabara, Tokyo

Established a US base in NextFlex (NextFlex is a Flexible Hybrid Electronics (FHE) consortium sponsored by the United States government, which is designed to create greater innovation in the market)

Investment from Niigata Venture Capital

Investment from LeadinWay.

Investment from Nidec Corporation

Investment from Real Tech Fund

Capital is increased to \525,266,700(JPY)

Opened a sales branch in Silicon Valley in the United States. (CONNECTEC AMERICA)

Business partnership with Fujikin Co., Ltd.

Investment from Shinsei Bank

Business alliance with MEMS Core, Inc

Investment from TNP On The Road Co.,Ltd. (Venture Capital)

Relocation of CONNECTEC KOREA Office

MSIVC2008V Investment Business Limited Partnership Mitsui Sumitomo Insurance Capital Corporation

Agent agreement with Chinese Semiconductor company, Jcap and commence sales promotion of its WLCSP and RDL ,etc. in Japanese domestic market.

Investment from KSP Co. Ltd. As KSP 3 Business Limited Partnership Unlimited partner

Establish office in ITRI Open-Lab Taiwan to have close contact with Taiwan customers and accelerate technological development and production expansion in
* ITRI (Industrial Technology Research)

Investment from NEC Capital Solutions Co., Ltd. And SMBC Venture Capital Co., Ltd. As Innovation Venture Investment limited for business. Unlimited Liability Union member.

Investment from Mizuho Capital Co., LTD as 3rd Mizuho Capital limited Business Investment Union. Unlimited liability Union member.

Certified as third “specific development plan” based on the Act on the Advancement of Manufacturing PCB technology for small and middle-sized enterprises in the Ministry of Economy, Trade and industry (Theme name: Ultra high density and damage-free bonding technology using soft bumps and development of next-generation semiconductor package

Established CONNECTEC Corporation (Office in TAIWAN)

Investment from Daishi Management Consulting Co., Ltd. (Venture Capital) as Daishi Corporate incubation fund project.

Investment from Neo Stella Capital Co., Ltd. (Venture Capital) as first Neo Stella investment project.

NEDO(New Energy and Industrial Technology Development Organization) subsidy project for Practical development of industrial technology for year 2010～2012. Project completed on 2nd February of 2012 and received the subsidy (payment).

Completed 2011 “New Foundation support subsidy” project of Niigata Industrial Creation organization on 29th February, 2011. Receive a grant (payment)

Investment from Namics Co., Ltd.

Signed license agreement with ChipMOS TECHNOLOGIES in Taiwan for joint development and comprehensive Business Alliance including investment

Niigata Industrial Creation organization. Year 2012 newly established project support subsidy confirmed.

Investment from SIP Co., Ltd. (Venture Capital) as digital convergence investments.

Investment from Niigata Venture Capital Co., Ltd. (Venture Capital) as the first Niigata Incubation Fund Investment.

Completed 2010 “New Foundation support subsidy” project of Niigata Industrial Creation organization on 28th February 2010. Receive a grant (payment)

Completed development subsidy project of the national small and medium-sized Enterprises Association of Japan on 31st December, 2010 as planed. Receive a grant (payment)

The national small and medium-sized business organization Central meeting “subsidy for development of products for small and medium Enterprises” grant decision and theme name: Development of fine pitch connection technology for display driver package

NEDO Grant decision and theme name of “Innovation practical development cost subsidy”: Practical development of fine pitch high performance tape carrier package

METI certified as a “specific development plan” based on the Act on the Advancement of Manufacturing Board technology for small and medium-sized enterprises. Theme Name: High performance and fine pitch COF of the package Development

Opened offices in Korea and China.

The “specific research and development plan” based on the Act on the Advancement of Manufacturing Board technology for small and middle-sized enterprises of the Ministry of Economy, Trade and industry: Development of high-performance semiconductor package using high-density mounting technology

Established CONNECTEC JAPAN CORPORATION