About the Company
History
Company History
History of Technology
Dec. 2023
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Acquired ISO9001 & ISO14001 certification
Nov. 2020
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Received the “300 Small and Medium Enterprises and Small Businesses” award in the category of “Manufacturing and Productivity” from the Ministry of Economy, Trade and Industry’s Small and Medium Enterprise Agency
Dec. 2019
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Received the Minister of Economy, Trade and Industry Award in the Manufacturing/Production Process Category at the 8th Monodzukuri Nippon Grand Awards
2018
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Achieved junction temperature of 80°C
Jun. 2018
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Certified as one of 97 companies nationwide selected for the Ministry of Economy, Trade and Industry’s “J-Startup Program”
Jul. 2017
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Opened base in Akihabara
Jul. 2017
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Opened base at NextFlex, USA
(NextFlex is a US government-sponsored consortium established with the aim of creating even greater innovation in the field of Flexible Hybrid Electronics [FHE] which has a rapidly growing market.)
Sep. 2016
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Achieved junction temperature of 120℃
Dec. 2015
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Opened a sales branch in Silicon Valley, US (CONNECTEC AMERICA)
Aug. 2015
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Completed first generation DTF flip chip bonder
Jun. 2015
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Entered business partnership with Fujikin Co., Ltd.
Dec. 2014
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Entered business partnership with Mems Core Co., Ltd.
Sep. 2014
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Achieved junction temperature of 150℃
Jun. 2013
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Relocated the CONNECTEC KOREA office
Mar. 2013
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Signed an agency agreement with JCAP in China and commenced handling WLCSP, RDL, etc. in Japan
Sep. 2012
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Opened office in Taiwan
A new office was established at the Industrial Technology Research Institute (ITRI) Open-Lab in Taiwan, in order to have close contact with Taiwanese businesses and accelerate technological development and production expansion in Taiwan.
* ITRI(Industrial Technology Research Institute)
Jul. 2012
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Certified as a “Specific Research and Development Plan” based on the Ministry of Economy, Trade and Industry’s Act on Enhancement of Small and Medium Sized Enterprises’ Core Manufacturing Technology (3rd case)
Theme name: Development of ultra-high-density, damage-free bonding technology and next-generation semiconductor packages using soft bumps
Jun. 2012
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Established CONNECTEC Corporation (Taiwanese subsidiary)
Mar. 2012
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On February 29, 2012, completed the “Industrial Technology Practical Development Cost Subsidy Project” (FY2010 to FY2012) of the New Energy and Industrial Technology Development Organization (NEDO). Receive grant (payment).
Jul. 2011
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Signed a comprehensive business partnership agreement with ChipMOS TECHNOLOGIES in Taiwan, including licensing, joint development, and investment from CONNECTEC JAPAN Corporation.
Nov. 2010
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First shipment of MONSTER PAC® type C samples (for Korean DSP manufacturer)
Sep. 2010
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Achieved junction temperature of 170°C
Jun. 2010
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Certified as a “Specific Research and Development Plan” based on the Ministry of Economy, Trade and Industry’s Act on Enhancement of Small and Medium Sized Enterprises’ Core Manufacturing Technology
Theme name: Development of high-performance, fine-pitch COF packages
May 2010
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First shipment of MONSTER PAC® type F samples (for Korean LCD driver manufacturer)
Mar. 2010
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Opened office in South Korea
Opened office in China
Mar. 2010
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Certified as a “Specific Research and Development Plan” based on the Ministry of Economy, Trade and Industry’s Act on Enhancement of Small and Medium Sized Enterprises’ Core Manufacturing Technology
Theme name: Development of high-performance semiconductor packages using high-density packaging technology
Nov. 2009
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CONNECTEC JAPAN Corporation established