SERVICEService
OSRDAOutsourced Semiconductor Reserch, Development & Assembly
We serve to design any kind of devices and modules, etc.
We offer ‘one stop R&D’ for device construction proposal, design, process proposal,
Prototype building, reliability testing, and volume production.
customer/CONNECTEC JAPAN
CONNECTEC JAPAN
MONSTER PAC®
- dispense
- flip chip bonding
new process development
- OSRDA
Outsourced Semiconductor Reserch,
Development & Assembly
customer
CONNECTEC engineers have good experience and technologies.
And we have wide selection of substrate materials, i.e. ceramic, organic, film, etc. for various semiconductor devices, DRAM, sensor and module, and build them with low temp./low load ‘damage free’ process.
Produce & promote
