Service

Our strength

Outsourced Semiconductor Reserch, Development & Assembly

We serve to design any kind of devices and modules, etc.

We offer ‘one stop R&D’ for device construction proposal, design, process proposal,
Prototype building, reliability testing, and volume production.

Our strength

Flow

1

customer/CONNECTEC JAPAN

Please contact us for any implementation requests.

document/inquiry wafer
2

CONNECTEC JAPAN

We provide solutions for customer implementation issues.

MONSTER PAC
  1. ・print
  2. ・dispense
  3. ・flip chip bonding

new process development

OSRDA
Outsourced Semiconductor Reserch, Development & Assembly)

Process
solutions for customer implementation issues.
3

Customer

We will introduce various case examples, and you can use products that meet your needs.

case examples case examples

About us

CONNECTEC engineers have
good experience and technologies.

And we have wide selection of substrate materials, i.e. ceramic, organic, film, etc. for various semiconductor devices, DRAM, sensor and module, and build them with low temp./low load ‘damage free’ process.

About us

Produce & promote

business project