Conventional solder joint process : min. pitch is 40um. Because solder joint temperature is 260℃. Thermal expansion is big.

Wafer process rule can reduce more and more, but die size can not shrink.

Connectec Japan are developing MONSTER PAC-10um, the world's first technology, narrow pitch bonding.

MONSTER PAC bonding temperature is 130℃.

Min Bonding pitch is 10um.

MONSTER PAC-10um can shrink the die size 75%.