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Trial Process Menu

In addition to the MonsterPAC process, Various process menu available.

With various processes available, i.e. our original flip chip process “MonsterPAC®”, and many others, CONNECTEC JAPAN technology is very flexible and capable to design and assemble semiconductors, modules, and substrates (Ex. Ceramic, organic, film, etc.) to meet your special requirement with process and structure optimization.

Wafer Bump

Process Step Process Materials,Equipment
Conductive paste printing Solder,silver,stencil printing
Stud bump Au-stud bump bonder
Electroless plating Ni/Au JCAP/domestic fab.outsourcing
Electroless plating,RDL,FOCSP JCAP outsourcing

Bump on substrates

Process Step Process Materials,Equipment
Conductive paste/solder printing FPC,organic,ceramic substrate,stencil printing

Wafer dicing

Process Step Process Materials,Equipment
Wafer dicing Si,piezo device,blade-dicer

Resin dicing

Process Step Process Materials,Equipment
NCP,underfill dispensing NCP first,underfill last process

Flip-chip bonding・Substrate bonding

Process Step Process Materials,Equipment
Thermal bonding of conductive paste Ni/Au-silver,Thermo-press bonder
Solder melt-bonding Au-Solder flip-chip,FPC-chip
Ultrasonic bonding Au-Au ultrasonic flip-chip bonder
ACF bonding ACF manual bonder

Cure

Process Step Process Materials,Equipment
Bonding resin hardening NCP,underfill hardening

Molding

Process Step Process Materials,Equipment
Sheet molding Resin sheet,molding machine

Marking

Process Step Process Materials,Equipment
Marking Laser marker

Substrate

Process Step Process Materials,Equipment
Substrate dicing Organic substrate,ceramic blade dicer

Testing

Process Step Process Materials,Equipment
Electrical testing Open/short tester
Inspection system Microscopes

Evaluation

Process Step Process Materials,Equipment
Physical testing SEM,IR microscopes,Laserdisplacement gage,X-ray transmission equipment,Measurement microscope
Reliability testing Thermal budget testing,constant temperature and humidity with bias
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