Trial Process Menu
Introducing various process examples
In addition to the MONSTER PAC process, which can be applied to a variety of substrate materials such as ceramic, organic, and film, depending on the mounting form of semiconductor chips and modules, we also support a variety of other processes.
We propose the optimal process and mounting structure to realize our customers’ requests.
Process
Process Step
Process Materials,
Equipment
Equipment
Case Examples
※Consultations Available
※Consultations Available
| Wafer Bump | Conductive Paste Printing | Solder, Silver, Stencil Printing | Minimum 60 µm Pitch |
|---|---|---|---|
| Stud Bump | Gold Stud Bump Bonder | Minimum 50 µm Pitch | |
| Electroless Plating | Ni/Au JCAP and Domestic Manufacturer Outsourcing | Minimum 10 µm Aperture | |
| Electroplating, Redistribution, FOWLP | JCAP Outsourcing | Layer Structure 1M to 3P3M, Maximum Wafer Size Φ300mm |
| Substrate Bump | Conductive Paste and Solder Printing | Conductive Paste on FPC, Organic, Ceramic Substrate, Stencil Printing | Minimum 60 µm Pitch |
|---|
| Wafer Dicing | Blade Dicing | Si, Piezoelectric Element, Blade Dicer | Maximum Wafer Size Φ300mm |
|---|---|---|---|
| Stealth Dicing | MEMS, Domestic Manufacturer Outsourcing | Maximum Wafer Size Φ200mm |
| Adhesive Resin Coating | Conductive Paste Printing | Solder, Silver / Stencil Printing | Minimum 60 µm Pitch |
|---|---|---|---|
| Stud Bump | Gold/Stud Bump Bonder | Minimum 50 µm Pitch | |
| Electroless Plating | Nickel/Gold Domestic Manufacturer Outsourcing | Minimum 10 µm Aperture | |
| Electroplating, Redistribution, FOWLP | Copper/JCAP Outsourcing | Layer Structure 1M to 3P3M, Maximum Wafer Size Φ300mm |
| Flip Chip Bonding Inter-Substrate Bonding |
Conductive Paste Thermocompression Bonding | Nickel-Gold/Silver Thermocompression Bonder | Minimum Accuracy ±2 µm |
|---|---|---|---|
| Solder Welding Bonding | Gold Stud-Solder, Solder-Solder, Thermocompression Bonder, Reflow |
Minimum Accuracy ±5 µm (Local Reflow) Minimum Accuracy ±30 µm (After Reflow) |
|
| Ultrasonic Bonding | Gold-Gold Ultrasonic Flip Chip Bonder | Minimum Accuracy ±5 µm | |
| ACF Bonding | Gold-Gold, Gold-Al, Gold-ITO Manual Flip Chip Bonder | Minimum Accuracy ±5 µm |
| Cure | Adhesive Curing | NCP, Underfill / Clean Oven | Room Temperature to 250°C |
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| Resin Sealing | Sheet Sealing | Resin Sheet / Sheet Sealing Device | Maximum Sealing Area 104mm × 45mm, Hollow Sealing Possible |
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| Marking | Marking | Laser Marker |
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| Substrate Dicing | Substrate Dicing | Organic Substrate, Ceramic, Blade Dicer |
|---|
| Inspection | Open-Short Inspection | Socket / Open-Short Tester | Up to 726 Pins |
|---|---|---|---|
| Function Inspection | Handler / External Outsourcing | Custom Specifications | |
| Visual Inspection | Measurement Microscope, Stereo Microscope | Custom Specifications |
| Evaluation | Physical Evaluation | SEM, IR Microscope, Laser Displacement Meter, X-ray Transmission Device, Measurement Microscope, Ion Milling | Maximum Wafer Size Φ300mm |
|---|---|---|---|
| Reliability Testing | Temperature Cycling Test / Internal Equipment High-Temperature Storage Test / Internal Equipment High Temperature Humidity Bias Test / Internal Equipment Others / External Outsourcing | -65°C to +150°C, Up to 200°C, 60°C 90%, 85°C 85% etc. |
| Chiplet | Passive/Active Si Interposer Manufacturing (Outsourced) | Support Glass Attachment/Release TSV (Cu Via) / RDL / CMP |
Wafer Size Φ200mm, Φ300mm Minimum TSV Diameter Φ10µm @Si Thickness 50µm Max 2 RDL Layers |
|---|---|---|---|
| 2D, 3D Packaging | Solder Bonding / Au-Au Ultrasonic Bonding / Conductive Paste Bonding / Wire Bond / Underfill |
Minimum Bonding Pitch 40µm Minimum Chip-to-Chip Distance 30µm |
