For products such as mobile information terminals, there is an increasing demand for variable-volume, multi-product production that matches end-user preferences and sales policies, due to the need for fashionability and simultaneous international releases.
Another problem is how to achieve diverse implementations, such as shortening the time required for model changes.

With existing packaging technologies, new development of small to medium quantities is difficult, and there are limitations on materials and manufacturing methods, so mass production requires bump processing at the wafer level, which limits flexibility and increases costs.

To address this issue, our MONSTER DTF will revolutionize semiconductor assembly plants.
MONSTER PAC, which is unique to us in the world, is a low-temperature, low-load construction method. By eliminating the excessive specifications of general-purpose mass production equipment, we can make the equipment smaller and lighter.

By combining this with local clean technology, we can build the world’s most compact semiconductor assembly line without the need for clean rooms.In addition, since no special chemicals are used and there is no noise, the factory can be built anywhere.For example, even in disaster-stricken areas, if there is a building the size of a convenience store, it is possible to freely set up a multi-product, variable-quantity production line, making it possible to quickly put together the necessary production systems in response to market needs.