MONSTER PAC
The world’s first and only MONSTER PAC core technology
Conventional technology involves forming bumps on the wafer (chip) side, but this requires fabrication during the wafer process, and the corresponding equipment must be for front-end processing.This resulted in longer construction times and higher costs.In addition, because the bump material is solder, high temperatures of 260°C to 270°C and high loads are required to bond it to the board.This could have serious consequences for low-k devices and MEMS chips, which are vulnerable to physical damage.
MONSTER PAC has solved these problems.
Bump On Material
Bumps are formed on the materials.Conjunctions are performed by conductive paste.
Process Flow
The world’s only low-temperature bonding process
It is the only manufacturing process in the world that enables mounting on flexible or stretchable substrates such as PET film substrates.
