Our company has a wide range of mounting technologies, from general wire bonding and solder bonding to low-temperature mounting using conductive paste for heat-sensitive chips, and mounting for high heat dissipation boards using sintered materials.

We receive many requests from semiconductor manufacturer for the medical industry, electronic device manufacturers and material manufacturers both in Japan and overseas as well as from contracted businesses such as universities and national research institutes.

The product applications we are requested to use include a large number of sensor and communication-related products that will support the IoT of the future, such as sensor modules and sensing devices, high-frequency communication modules exceeding millimeter waves, optical communications, and photonics-electronics convergence technologies. In addition, we also have processors for AI and supercomputers, and products that use chiplet technology.
Thanks to you, we currently receive more than 300 requests per year, and we are working on a wide range of customer requests and challenges in a very wide range of fields.

For issues that cannot be handled with our own technology, we can meet even the most difficult requests by collaborating with partner companies that possess excellent technology, both domestically and internationally.